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NEWS TAGGED ADVANCED PACKAGING
Thursday 11 August 2022
IC analysis and inspection demand robust for advanced-node chips, advanced packaging
Demand for materials analysis (MA) and reliability analysis (RA) services remains robust for chips built using advanced process manufacturing and advanced packaging, according to...
Tuesday 2 August 2022
Competition heats up for advanced packaging among OSATs in Taiwan and China
In the advanced packaging field, the competition among OSATS on both sides of the Taiwan Straits, such as Taiwan-based ASE Technology Holding and China-based JCET Group, is heating...
Friday 29 July 2022
ASE Technology says revenue on track to grow through 4Q22
ASE Technology Holding (ASEH) has reiterated the OSAT will post sequential revenue increases through the fourth quarter of this year despite heightened macro volatility.
Wednesday 27 July 2022
OSATs slowing down mature packaging capacity expansion
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Monday 25 July 2022
Foundries reportedly adjusting capacity expansion plans in 2H22
Many foundry houses and IDMs are mulling scaling back or postponing their capacity expansions amid sharply weakening chip demand for consumer applications, except for TSMC, which...
Friday 22 July 2022
Taiwan backend firms gearing up for next-gen HPC processors
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
Monday 18 July 2022
TSMC on track to develop InFO_3D tech for mobile device chips
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
Friday 15 July 2022
Advanced packaging demand remains brisk
Taiwan-based OSATs including ASE Technology and Powertech Technology (PTI) continue to see their midrange and high-end IC packaging manufacturing capacity utilization rates stay at...
Monday 4 July 2022
ASML, TSMC shed lights on advanced solutions at CSTIC 2022
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
Tuesday 28 June 2022
MSScorps sees promising demand for advanced packaging, 3rd-gen semiconductors
IC analysis and inspection lab Material Science Service (MSScorps) is upbeat about its longer-term business prospects, citing brisk demand for advanced packaging and third-generation...
Monday 27 June 2022
TSMC completes cleanroom construction at R&D center in Japan
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...
Friday 24 June 2022
Foxconn expands IC backend biz through affiliates
Foxconn Technology (Hon Hai Precision Industry) has been expanding its IC backend business through subsidiaries, such as ShunSin Technology and Qingdao KoreSemi, according to industry...
Friday 17 June 2022
TSMC debuts N2 process utilizing nanosheet transistors
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Friday 17 June 2022
Substrate-free FOPLP technology gaining ground in advanced packaging market
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...