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NEWS TAGGED ADVANCED PACKAGING
Wednesday 27 March 2024
Japan-based suppliers capitalize on emerging glass substrate as chipmakers embrace advanced packaging
As global chipmaking leaders like Intel are optimistic about introducing glass substrates for advanced IC packaging, Japan-based PCB suppliers are capitalizing on the emerging tech...
Thursday 21 March 2024
ASE expands VIPack advanced packaging solutions for AI device apps
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
Thursday 21 March 2024
ASEH acquires land for new factory site in Mexico
Taiwanese OSAT ASE Technology Holding (ASEH) has acquired 37,220 square meters of land in Jalisco, Mexico.
Wednesday 20 March 2024
TSMC Japan 3DIC R&D Center increases partners to meet AI chip solution demand
TSMC Japan 3DIC R&D Center, located at Tsukuba Shi of the Ibaraki Prefecture, is now developing solutions for enlarging AI chip substrates.
Tuesday 19 March 2024
TSMC chooses CoWoS factory site while continuing 3nm capacity expansion
TSMC confirmed that a CoWoS advanced packaging factory will be set up in Chiayi, a farming county and mid-sized city combined (with a 700,000 population), located north of Tainan.
Tuesday 19 March 2024
TSMC to build two advanced packaging fabs in southern Taiwan
TSMC plans to set up two new advanced packaging fabs in Chiayi, southern Taiwan, a high-ranking Taiwanese government official has announced.
Friday 15 March 2024
Wah Lee returns to growth trajectory as advanced packaging gains traction
Semiconductor material equipment supplier Wah Lee Industrial Group reported a revenue of NT$66.78 billion in 2023, a year-on-year decrease of 9.2%, with a combined after-tax net profit...
Thursday 14 March 2024
APT upbeat about orders for advanced packaging
AblePrint Technology (APT), a company specializing in pneumatic and thermal process solutions for semiconductor packaging, is optimistic about the growing demand for advanced packaging...
Friday 23 February 2024
Intel is grabbing Samsung's cheese with system-level foundry
Samsung beware: As Intel Foundry (IF) is now collaborating with TSMC to accomplish an advanced packaging mission to meet customer's needs, it is aiming for something bigger.
Wednesday 21 February 2024
AI to boost advanced packaging demand
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Thursday 15 February 2024
Samsung embraces hybrid bonding for advanced non-memory packaging
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
Thursday 15 February 2024
OpenAI's trillion-dollar chip plan can end well if right move is made
Nvidia's many customers, including Open AI CEO Sam Altman, are trying to find ways to cut dependency on its AI chips. While specialists have pointed out that Altman's lack of understanding...
Tuesday 6 February 2024
Japan's semiconductor renaissance (2): advanced packaging and materials
The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding...
Friday 2 February 2024
OSAT ASEH to boost advanced packaging capability
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...
Friday 2 February 2024
IC materials distributors gear up for advanced packaging materials demand as customer inventory adjustments end
According to industry sources, IC material distributors anticipate customer inventory adjustments will end in the first half of 2024, with AI expected to accelerate growth in the...
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Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research