Monday 28 October 2019
VCSEL foundry houses, backend specialists see strong demand
Taiwan's GaAs foundry houses and VCSEL and DOE (diffraction optical element) backend specialists are set to land more follow-up orders from Apple in the fourth quarter of 2019 and...
Tuesday 8 October 2019
Win Semi 3Q19 revenues beat guidance
GaAs foundry Win Semiconductors' third-quarter 2019 revenues climbed over 40% sequentially, beating its estimate of about 30% growth, due partly to strong demand for compound semiconductor...
Monday 7 October 2019
Xintec eyeing return to profit in 2019
Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.
Monday 30 September 2019
Optical fingerprint sensors shipments to ramp up in 1Q20
Taiwan's IC designers are set to ramp up shipments of diverse optical in-display fingerprint sensors for smartphone application starting in the first quarter of 2020, and backend...
Monday 19 August 2019
Demand for GaN-based components set for long-term growth
Demand for GaN-based RF components and power amplifiers (PAs) is heading for long-term growth along with the establishment of 5G networks, according to industry sources.
Friday 16 August 2019
Backend firm Xintec focuses more on high-profit CIS applications
CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...
Friday 16 August 2019
Win Semi, Xintec and ShunSin ramping up shipments for 3D sensing components
GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter...
Wednesday 14 August 2019
Wafer-level backend demand promising
The manufacture of under-display optical fingerprint sensors for use in 5G-enabled phones will require wafer-level backend services. Suppliers capable of providing wafer-level backend...
Friday 19 July 2019
IC backend supply chain buoyed by TSMC positive 3Q19 outlook
Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end...
Wednesday 10 July 2019
Order visibility for IC packaging materials clear throughout 3Q19
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Tuesday 9 July 2019
Taiwan chipmakers gearing up for 3D sensor market boom
Foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), epitaxial wafer supplier Visual Photonics Epitaxy (VPEC), fabless chipmaker Himax Technologies,...
Monday 3 June 2019
Xintec cautious about 2019
Niche-market IC packaging house Xintec continues to expand its offerings and client portfolio in its target markets, and remains focused on wafer-level packaging, according to company...
Wednesday 20 February 2019
IC packager Xintec expects revenues to pick up in 2Q19
Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...
Wednesday 22 August 2018
Shipments of 3D sensing components for smartphones picking up
Taiwan-based makers in the 3D sensing components supply chain, including VCSEL suppliers and 3D packaging firms, have seen their shipments start picking up recently after a slowdown...
Monday 13 August 2018
Xintec posts wider loss in 1H18
Image sensor packaging specialist Xintec saw its net losses widen to NT$5.81 (US$0.19) per share in the first half of 2018 from NT$2.25 a year earlier.