Tuesday 15 September 2020
CIS packager Xintec posts record revenues for August
CIS and 3D sensor packaging specialist Xintec saw its revenues for August 2020 climb 21.2% sequentially and 23.44% annually to a record high of NT$740 million with revenues for the...
Friday 14 August 2020
Xintec sees 12-inch wafer probing as new growth driver
Taiwan-based CIS and 3D sensor packaging specialist Xintec has kicked off volume production at its newly-installed 12-inch wafer probing lines since July, and expects the new business...
Tuesday 28 July 2020
Taiwan OSAT providers expect Intel to step up outsourcing
Intel is expected to step up its outsourcing of chips and processors, particularly GPUs and IoT chips, for years to come, according to sources at Taiwan-based outsourced assembly...
Monday 20 July 2020
Taiwan GaAs supply chain to log robust 5G PA shipments in 2H20
Taiwan's GaAs foundry houses Win Semiconductors and Advanced Wireless Semiconductor (AWSC) and epi-wafer supplier Visual Photonics Epitaxy (VPEC) are set to enjoy robust PA (power...
Tuesday 14 July 2020
CIS backend firms tap deeper into auto field with On-Semi, Sony
With major CMOS image sensor (CIS) vendors including On Semiconductor and Sony set to put increased focus on automotive applications, Taiwan-based backend houses including Tong Hsing...
Monday 20 April 2020
TSMC ecosystem players to see positive 2020 despite pandemic
Members in the TSMC Grand Alliance have been fully assured that their revenue and profit growth momentum will not slow down in the months ahead, bolstered by the foundry's better-than-expected...
Tuesday 14 April 2020
Taiwan CIS, 3D sensor packagers see revenues rally on strong demand
CMOS image sensor (CIS) devices have seen a rapid surge in demand for security surveillance and video conferencing applications due to lockdowns amid the coronavirus pandemic. This,...
Tuesday 24 March 2020
CIS backend specialists expanding capacity
CMOS image sensor (CIS) backend specialists including Tong Hsing Electronic Industries and Xintec are expanding capacity seeking to satisfy growing demand for multi-lens camera pho...
Wednesday 11 March 2020
IC backend, verification partners for Apple devices see bright 2020
IC backend and verification specialists in the supply chain of Apple devices have regained confidence in their revenue performances for 2020 as they are moving to deliver shipments...
Tuesday 3 March 2020
VisEra to build new color filter plant to serve Sony
Color filter (CF) maker VisEra Technologies, a subsidiary of TSMC, will establish a new plant in Longtan, northern Taiwan and is eyeing new orders from Sony, according to industry...
Friday 14 February 2020
Xintec turns profitable in 2019, set to gain more from 3D DOE devices
TSMC-reinvested backend house Xintec will see little seasonality impact on its revenues for the first half of 2020 as robust packaging demand for DOE (diffractive optical element)...
Friday 7 February 2020
CIS, VCSEL makers see robust demand for ToF phone cameras in 2H20
Taiwan-based makers of CMOS image sensor (CIS) and VCSEL components are optimistic that multi-lens camera modules incorporating ToF (time of flight) sensing technology will be mass-adopted...
Tuesday 14 January 2020
OmniVision set to raise quotes for diverse CIS devices by 10-40%
OmniVision Technologies will raise its quotes for various CMOS image sensors (CIS) by 10-40% in 2020 to counter ever-expanding demand for application to handsets, notebooks, smart...
Thursday 26 December 2019
Xintec profit soars in November
Niche-market IC packaging house Xintec has disclosed its net profit surged 252% from a year ago to NT$74 million (US$2.46 million) in November 2019. EPS for the month came to NT$0....
Monday 16 December 2019
TSMC places test equipment orders with Teradyne
TSMC has placed orders for several hundred sets of test equipment with Teradyne, and will install the tools at the foundry's new advanced backend plant in northern Taiwan, according...
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