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NEWS TAGGED WINBOND
Friday 24 November 2017
Global mobile DRAM revenues to surge in 4Q17, says DRAMeXchange
Average prices for mobile DRAM chips are expected to rise 10-15% sequentially in the fourth quarter of 2017, when the industry will enjoy a higher sequential increase in output value...
Tuesday 21 November 2017
Nova to see more orders from memory clients in 2018
Taiwan-based Nova Technology, an expert in integrating water, gas and chemical engineering systems for semiconductor, photonics and other high-tech sectors, is expected to capture...
Wednesday 8 November 2017
Winbond revenues rise 21% on year in October
Winbond Electronics has reported consolidated revenues of NT$4.491 billion (US$148.75 million) for October 2017, representing a 4.07% increase on month and 21.06% increase on year.
Friday 3 November 2017
Walton 3Q17 profits hike
Memory-IC backend specialist Walton Advanced Engineering has reported net profits for the third quarter of 2017 reached NT$248 million (US$8.22 million), which already exceeded the...
Tuesday 31 October 2017
China firms to invest CNY18 billion to develop 19nm DRAM technology
China-based GigaDevice Semiconductor and Hefei RuiLi Integrated Circuit Manufacture (formerly Hefei ChangXin IC) will team up to develop 19nm DRAM process technology for the production...
Friday 27 October 2017
Winbond 3Q17 profits hike
Specialty DRAM and flash chipmaker Winbond Electronics has reported net profits of NT$2.08 billion (US$68.9 million) for the third quarter of 2017, which already exceeded the total...
Wednesday 11 October 2017
Winbond revenues up in September
Winbond Electronics has reported consolidated revenues of NT$4.316 billion (US$142.75 million) for September 2017, representing a 1.91% increase on month and 18.84% increase on yea...
Wednesday 27 September 2017
Winbond to break ground on new 12-inch fab in mid-2018
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to break ground on a new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...
Tuesday 19 September 2017
GigaDevice signs wafer supply contract with SMIC
China-based GigaDevice Semiconductor, a maker of flash memory devices and microcontroller (MCU) chips, has signed a strategic agreement on the supply of wafers worth about CNY1.2...
Thursday 7 September 2017
Taiwan memory chipmakers see August revenues increase
Mask ROM and flash specialist Macronix International has reported August revenues surged 19.5% sequentially while specialty DRAM and flash chipmaker Winbond Electronics' August revenues...
Wednesday 6 September 2017
Winbond to set up new fab in southern Taiwan
Taiwan's Ministry of Science and Technology (MOST) has approved specialty DRAM and flash maker Winbond Electronics' plan to set up a new fab at the Kaohsiung Science Park (KSP), southern...
Monday 4 September 2017
Upstream material suppliers in new iPhone supply chain to see strong growth
With Apple expected to launch its new iPhone soon, Taiwan players in the US vendor's smartphone supply chain are warming up to embrace a new round of business boom, with the upstream...
Thursday 31 August 2017
Probe card demand for memory chips, high-end APs remains strong
Semiconductor probe card demand for the manufacture of memory chips and high-end application processors (APs) has been strong, whereas that for the production of LCD driver ICs and...
Wednesday 30 August 2017
GigaDevice draws investment from China state-backed fund
China-based GigaDevice Semiconductor has obtained investment from China's National IC Industry Investment Fund, commonly known as the Big Fund, according to the maker of flash memory...
Wednesday 23 August 2017
Winbond announces equipment purchases
Winbond Electronics, a memory chipmaker specializing in specialty DRAM and flash memory chips, has disclosed two purchases of machinery equipment from Lam Research and Tokyo Electron...