Winbond to open new fab in southern Taiwan by 2021

Siu Han, Taipei; Jessie Shen, DIGITIMES Asia Monday 17 June 2019 0

Winbond Electronics expects to start operating a new 12-inch wafer plant in Kaohsiung, southern Taiwan by 2021, when the DRAM and flash memory chipmaker has its in-house developed 20nm process technology ready for commercial production.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.

Email address

Password

Save my User ID and Password

Save my User ID and Password

Some subscribers prefer to save their log-in information so they do not have to enter their User ID and Password each time they visit the site. To activate this function, check the 'Save my User ID and Password' box in the log-in section. This will save the password on the computer you're using to access the site.

Note: If you choose to use the log-out feature, you will lose your saved information. This means you will be required to log-in the next time you visit our site.

NEW individual users please REGISTER first.

Enterprise user first-time LOGIN.

I forgot my ID and/or password?

MEMBERSHIP BENEFITS

Full access to articles dating back to 2000.
Real-time access to the news as it breaks.
Access to premium content.
Full access to Before Going to Press.
Asia Supply Chain 100 dataset access.
Access to research insights.