In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor...
The foldable phone market is finally hitting its stride. After years of false starts and skeptical consumers, the segment is experiencing genuine momentum. Counterpoint Research projects...
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
As holiday seasons approach, including China's Singles' Day and Black Friday in Europe and the US, the smartphone panel market has maintained high utilization rates in the fourth...
Nvidia plans to launch its Vera Rubin architecture AI servers in 2026, significantly increasing the share of liquid cooling solutions. In response, heat dissipation manufacturers...
SK Hynix achieved its strongest quarterly results on record in the third quarter of 2025, driven by surging demand for AI-related memory and higher DRAM and NAND prices. The company...
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recorded 24.4489 trillion won in revenues, 11.3834 trillion won in operating profit (with...
Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC),...
US electronic design automation (EDA) software company Cadence Design Systems posted third-quarter 2025 revenue of US$1.34 billion, up 10% from a year earlier and slightly above analysts'...
To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
The memory chip shortage has escalated into a severe crisis as upstream international manufacturers finalize contract prices for the fourth quarter of 2025. Intense competition for...
Taiwan-based memory manufacturer Winbond Electronics Corp. has approved a capex budget of NT$35.509 billion (US$1.16 billion) to restructure its memory production capacity in response...
The global memory market is entering a "super cycle" driven by the booming adoption of AI, data center upgrades, and growing demand for high-performance computing (HPC). With inventories...
As demand for memory surges alongside the build-out of AI infrastructure and soaring data volumes from AI agents developed by OpenAI, Google, and others, consumption has spiked not...
