Electronic shelf labels (ESL) using e-paper technology have experienced rapid growth in the retail industry, propelled by Walmart's large-scale adoption since mid-2024. ESL shipments...
Despite facing global end-market inventory adjustments and rising geopolitical uncertainties, Taiwan's printed circuit board (PCB) supply chain is shifting its capital expenditure...
Fujifilm Electronic Materials is considering a significant investment in India as part of its strategy to expand in the fast-growing semiconductor sector, according to a report by...
Kinpo Group president Andrew Chen announced on September 3 that the company expects a more balanced revenue split in 2025, departing from their usual stronger second half caused by...
Hewlett Packard Enterprise (HPE) reported third-quarter fiscal year 2025 revenue of US$9.1 billion, surpassing analyst estimates, driven by strong demand for AI servers and networking...
Taiwan-based chip probing and testing solution provider Chunghwa Precision Test announced a 37% year-over-year revenue increase in August 2024, driven by rising demand for next-generation...
Hermes Testing, a testing solutions provider under Hermes Epitek, is leveraging its machine engineering services and customized equipment manufacturing to address growing demand in...
US artificial intelligence (AI) startup Anthropic has secured US$13 billion in its series F funding round, tripling its valuation to US$183 billion and positioning it as the world's...
Japan's Anritsu has teamed up with US chipmaker AMD to launch an automated testing platform for next-generation high-speed transmission, targeting the surging demand from AI data...
China is ramping up efforts to build an integrated nationwide computing network as the global race for artificial intelligence (AI) intensifies. The State Council's "AI+" strategy...
China's smartphone shipments fell nearly 4% in the first half of 2025 compared to the same period in 2024, despite government initiatives aimed at stimulating demand through purchase...
TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding...
Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...