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Wednesday 28 October 2026
Simmtech steps up SOCAMM investment as BT substrate supply tightens
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
Wednesday 28 October 2026
Semiconductor equipment is not AI chip growth's biggest bottleneck
AI is driving a steady upward revision in chip demand, but semiconductor equipment shortages are not the biggest obstacle to expanding AI chip production, according to industry sources...
Wednesday 28 October 2026
TLB develops SOCAMM3 substrates; Vietnam plant to break ground
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
Wednesday 28 October 2026
Google prioritizes frontier AI as cloud capacity runs short
Google recently unveiled its flagship AI model, Gemini 4 Argon. The model consumed an unprecedented 25 trillion tokens within 72 hours of launch—three times the volume recorded...
Wednesday 28 October 2026
Goke Microelectronics raises KGD packaging prices again
China-based IC design firm Goke Microelectronics will raise prices for its Known Good Die (KGD) packaged products by US$0.5 to US$1.5 per unit from November 2026, depending on capacity...
Wednesday 28 October 2026
CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry
China's CXMT has reportedly declined Apple's inquiry about purchasing DRAM, prioritizing supply to domestic customers instead. As global memory supplies tighten and prices rise, the...
Wednesday 28 October 2026
Analysis: What happens if Claude demand cools before its compute bills do?
Anthropic's IPO filing presents a company growing quickly enough to justify one of the AI industry's most aggressive infrastructure buildouts. But buried in the prospectus is a less...
Wednesday 28 October 2026
SK hynix Announces 3Q26 Financial Results

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recorded 104.6155 trillion won in revenues, 83.3338 trillion won in operating profit (with...

Tuesday 27 October 2026
Nvidia DSX POD challenges traditional AI data center construction
At its GTC conference in Berlin, Nvidia discussed the RTX Spark notebook, various implementations and partnerships involving physical AI, AI agents, and CUDA-X, as well as the DSX...
Tuesday 27 October 2026
Infineon and ASMedia team up on end-to-end USB 20Gbps setup for AI cameras
Infineon Technologies and ASMedia have announced a partnership to speed up the adoption of 20Gbps USB, driven by demand from machine-learning cameras and other physical AI devices...
Tuesday 27 October 2026
AI data centers drive cooling, power, modular infrastructure demand
As AI server computing density and server rack power consumption rise, data center construction must also take into account cooling, power distribution, energy management, and electromechanical...
Tuesday 27 October 2026
Mitsubishi Materials scales thermistor capacity sixfold amid AI boom
Mitsubishi Materials will expand production of thermistors, temperature sensors used in optical communications equipment, as the spread of generative AI drives demand for optical transceivers...
Tuesday 27 October 2026
AI demand squeezes automotive memory, pushing automakers to take control of chip supply
Expanding investment in AI data centers is putting pressure on memory supply and demand across the automotive industry. As semiconductor companies prioritize high-bandwidth memory...
Tuesday 27 October 2026
AMD, Nvidia target substrate capacity amid 4x expansion constraints
AMD and Nvidia have separately invested in supply-chain capacity expansion, making substrates, packaging, and testing key priorities as AI demand diversifies. The moves show that chipmakers...