CONNECT WITH US
NEWS TAGGED DEMAND
Wednesday 27 May 2026
Taiwan smartphone shipments fell nearly 4% in April as component costs push prices higher
Taiwan's smartphone shipments declined in April 2026 as the market entered its traditional slow season and rising component prices pressured handset pricing, industry participants...
Wednesday 27 May 2026
Aixtron wins orders from Lumentum for G10-AsP systems to expand InP production
Aixtron has received multiple orders from Lumentum for its G10-AsP MOCVD systems, a move that could boost global production of indium phosphide (InP) lasers and detectors for 800G...
Wednesday 27 May 2026
Quality Innovation Powering AI: ZEISS Makes COMPUTEX Forum Debut

ZEISS, a global leader in optics and optoelectronics, will bring the quality discussion to the official COMPUTEX 2026 Forum stage for the first time this year, highlighting...

Wednesday 27 May 2026
Mexico emerges as new front line in global auto supply chain
Amid a sweeping reconfiguration of global supply chains, North America—and Mexico in particular—has emerged as a critical battleground for manufacturers caught between...
Wednesday 27 May 2026
Taiwan optoelectronics materials maker Wah Hong targets high-end PCB and chip packaging demand

AI, low-carbon sustainability, smart cities, and advanced displays are set to drive the global optoelectronics industry in 2026, shifting...

Wednesday 27 May 2026
Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way
Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...
Wednesday 27 May 2026
PCB drill bit maker Topoint raises NT$600 million, brings in PCB giants as strategic investors
Printed circuit board (PCB) drill bit manufacturer Topoint Technology approved a private placement of unsecured convertible corporate bonds with a maximum issuance amount of NT$600...
Tuesday 26 May 2026
Darfon Electronics invests in AI cooling systems maker GrAndvance
As demand for high-performance computing continues to rise, thermal management has emerged as one of the most critical constraints on server performance. Liquid cooling systems, once...
Tuesday 26 May 2026
The US$16.5 Billion Bet: How Co-Packaged Optics Will Rewire AI's Backbone by 2030
As AI clusters continue to scale, traditional interconnect architectures are facing new limits in bandwidth, power efficiency, and system integration. Co-Packaged Optics is emerging...
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Wonderful Hi-Tech sees rising demand from low-orbit satellites and AI data centers
At its annual shareholders' meeting on May 25, Ringo Chang, chairman of Wonderful Hi-Tech, said the cable and connectivity supplier expects revenue growth to resume in 2026, with profit...
Tuesday 26 May 2026
Wiwynn expands US capacity as AI server boom strains power and supply chains

Taiwan-based AI server maker Wiwynn is accelerating its global expansion as surging demand for AI infrastructure creates mounting pressure...

Tuesday 26 May 2026
AMD and Nvidia deepen investments in Taiwan semiconductor ecosystem

When AMD CEO Lisa Su arrived in Taiwan on May 20, she announced plans to invest more than US$10 billion with local supply-chain partners...

Tuesday 26 May 2026
Win Semiconductors bets on optical and satellite communications growth
Facing expanding opportunities in both optical communications and satellite connectivity, Dennis Chen, chairman of Win Semiconductors, said the company is actively advancing a range...
Tuesday 26 May 2026
Samsung's P4 HBM push could worsen DRAM crunch in 2027

Samsung Electronics is reportedly preparing to allocate much of its Pyeongtaek P4 cleanroom capacity to next-generation high-bandwidth...