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NEWS TAGGED DEMAND
Wednesday 14 October 2026
Memory bottlenecks drive HBM shift to 8-layer stacks
As the gap between memory supply and demand widens due to the surge in AI applications, supply chain sources report that major GPU and custom ASIC vendors are considering lower-spec...
Wednesday 14 October 2026
Taiwan's export boom shifts toward AI servers, raising concentration risks
Taiwan's export surge is increasingly tied to high-value AI servers and pricier memory chips, a shift with implications far beyond the island. As exports climb, the outlook underscores...
Wednesday 14 October 2026
Adani and Jabil plan 50:50 JV to make AI data center hardware in India
A proposed Adani-Jabil venture could boost India's role in the global AI supply chain by adding local manufacturing of servers, racks, and cooling systems. If approved, the tie-up...
Wednesday 14 October 2026
Yaskawa targets 2030 humanoid robot rollout as AI lifts forecast
Japan's Yaskawa Electric plans to launch humanoid robots within the next one to two years and expects AI-powered humanoid robots to enter widespread use around 2030. The company also...
Wednesday 14 October 2026
AP Memory completes US$415.5M GDR offering, boosts three product lines
Memory IC design house AP Memory Technology has successfully priced its global depositary receipt (GDR) offering, raising a total of US$415.5 million. The GDRs were priced at US$56.15...
Wednesday 14 October 2026
SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
Wednesday 14 October 2026
Applied Materials lifts 2030 margin goals, but a missing industry forecast sends a disappointing signal
Applied Materials used its investor day to argue that AI will let it outgrow the chip equipment market through 2030. Investors, however, focused on what the company left out: a forecast...
Wednesday 14 October 2026
TSMC-GF interposer deal reshapes US AI supply chain, from CoWoS to HBM
GlobalFoundries (GF) and TSMC have reached a manufacturing agreement to establish a US-based supply source for silicon interposers supporting TSMC's CoWoS advanced packaging ecosystem...
Wednesday 14 October 2026
AI memory boom pushes smartphone market into premium-first reset
While the rapid advancement of AI has driven steadily growing investment in large-scale infrastructure, one of its downstream effects is becoming increasingly visible in the memory...
Wednesday 14 October 2026
PMIC vendors diverge as PC exposure drives revenue gap
Taiwanese power management IC (PMIC) vendors reported their September and third-quarter 2026 revenue, with results diverging as PC exposure widened the performance gap. Global Mixed-mode...
Wednesday 14 October 2026
Smartphone costs surge as brands take divergent action
Memory prices have surged 4–5x in recent years, and smartphone brands' efforts to pass those costs on to consumers have already hurt sales of new devices in 2026. With large-scale...
Wednesday 14 October 2026
Y.S. Tech reports liquid-cooling orders secured through early 2028
Y.S. Tech said automotive product orders were visible through the first quarter of 2028 as the automotive electronics and technology systems maker expanded its automotive and high-performance...
Wednesday 14 October 2026
Amazon's Decart talks point to a broader push from custom silicon to world models
As custom AI silicon proliferates alongside growing demand for heterogeneous compute, the ability to move and optimize workloads across different accelerators is becoming an increasingly...
Wednesday 14 October 2026
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era

The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced...

Tuesday 13 October 2026
Taiwan panel makers enter semiconductor fight as structural challenges persist
Entering the fourth quarter of 2026, panel makers face pressure from rising component costs and weakening demand. However, price hikes and production cuts led by Chinese panel manufacturers...