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Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
UMC raises capex to US$2B, eyes AI SiPh
UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed...
Friday 31 July 2026
US manufacturing push draws Taiwan suppliers; electronics investment up nearly 500%

TSMC chairman C.C. Wei has announced an additional US$100 billion investment for building capacity in the US, on top of the company's...

Friday 31 July 2026
Chang Wah sees broadening demand recovery and higher margins in 2Q26
Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening...
Friday 31 July 2026
AI server BBU demand triples battery-module capacity ahead of 800V HVDC rollout

Backup battery units are set to become standard equipment in AI servers using 800V high-voltage direct current architectures, according...

Friday 31 July 2026
Coretronic drone unit shifts to four fronts amid procurement delay
Coretronic said its robotics subsidiary, Coretronic Intelligent Robotics (CIRC), is focusing on four development priorities as a large domestic government drone procurement plan remains...
Friday 31 July 2026
Automakers shift to larger in-car displays as smaller center screens decline
Global automakers are moving toward larger, more integrated cockpit displays as in-car screens become the main interface between drivers, passengers, and vehicles. According to Counterpoint...
Friday 31 July 2026
CSCC develops SiC crucibles to strengthen Taiwan’s AI data center supply chain
China Steel Corporation affiliate CSCC has developed 6N high-purity isotropic graphite blocks for 8-inch and 12-inch silicon carbide (SiC) crystal growth crucibles, aiming to reduce...
Thursday 30 July 2026
ASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity
ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened...
Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
Microsoft's AI buildout: 88 new data centers, broader model catalog, silicon gains

Microsoft CEO Satya Nadella laid out how the company is scaling its AI infrastructure and platform to keep pace with demand. He outlined...

Thursday 30 July 2026
High memory prices could slow China's AI push, analyst says

Memory prices are expected to remain elevated through 2026 as AI and data-center demand strains supply, with meaningful supply relief...

Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
Samsung foundry to double 2nm design wins in 2026 on Broadcom talks; claims profit turnaround 'possible in near term'

Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in...