Liquid cooling is becoming mainstream in AI servers, prompting data-center customers to assess pumps that can move 100 metric tons of water per hour as chip heat rises. Taiwan pump...
China's IC designers are expanding into high-speed interconnect technologies as AI inference and agent applications fuel demand for server CPUs, memory modules and connectivity chips...
Texas Instruments' third quarter suggested the analog chip upturn has moved beyond restocking into a broad-based recovery, and that the company's multi-year build-out of 12-inch wafer...
IBM's third quarter went some way towards answering whether the deal slippage that hit its second quarter reflected weaker demand or delayed timing. Revenue rose 5% year on year, or...
Chief Telecom has begun construction of its new AI data center in the Huwei section of the Central Taiwan Science Park (CTSP), with an investment of NT$3.3 billion (US$101.8 million)...
Persistent supply shortages have kept the niche memory market hot, with Elite Semiconductor Microelectronics Technology (ESMT) estimating that the structural supply gap exceeds 30%...
The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...
As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...
Market expectations for cloud AI demand have generally remained bullish through 2028-2029, with order visibility extending clearly over the next two to three years. The outlook for...
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...
Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.
