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    LG Electronics's three strategies to counter competition from Chinese brands
    4h 35min ago
    China's SeeYA wins Meta’s MR panel order as BOE misses certification
    4h 35min ago
    Qualcomm says HBC memory architecture offers better value than HBM as hyperscalers show interest
    4h 35min ago
    InP enters a capacity race as TCL moves into indium phosphide laser chips
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    Taiwan’s semiconductor materials sector sees opportunity in advanced packaging and CPO
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    Huawei lifted R&D spending to push AI chips and semiconductor self-reliance
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    NEWS TAGGED DEMAND
    Monday 31 August 2026
    China silicon wafers enter AI-led upcycle: prices rise, 12-inch capacity expands

    Hangzhou Lion Microelectronics plans to invest about CNY3 billion (approx. US$446 million) in a new 12-inch silicon wafer project in Jiaxing,...

    Monday 31 August 2026
    Interview: Taiwan's National Atomic Research Institute eyes SMRs for AI power shift
    As global net-zero efforts intensify, governments and major technology companies are investing in emerging nuclear technologies to meet the huge electricity demand from AI data centers...
    Monday 31 August 2026
    Musk tackles key AI power bottleneck with in-house turbine foundry
    A move by SpaceX to manufacture turbine blades in-house could ease a global bottleneck in AI infrastructure, where power equipment is now as constrained as chips. If successful, the...
    Monday 31 August 2026
    Taisic Materials produces Taiwan's first 12-inch SiC boule with homegrown crystal growth furnace
    Taisic Materials, a subsidiary of Kenmec Mechanical Engineering, has successfully produced Taiwan's first 12-inch silicon carbide (SiC) boule using a crystal growth furnace independently...
    Monday 31 August 2026
    Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
    Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
    Monday 31 August 2026
    Lightel posts record first-half revenue, profit as LEO satellite demand rises
    Lightel Technologies reported record first-half results for 2026, with consolidated revenue reaching NT$590 million (US$18.7 million), net profit at NT$107 million, and earnings per...
    Monday 31 August 2026
    Samsung launches Galaxy S26 FE with lower price
    Samsung Electronics launched its Galaxy S26 Fan Edition in the second half of 2026 with a starting price of 1.045 million won in South Korea, or about US$714, as it sought to round...
    Monday 31 August 2026
    India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
    India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
    Monday 31 August 2026
    China optical display investment shrinks 80% in 1H26
    China's optical display industry is cooling after years of aggressive panel fab construction that has reshaped the global display landscape. Investments in China's optical display...
    Monday 31 August 2026
    Tex Year's specialty chemicals push could reshape its growth mix as AI and optics expand
    Tex Year is widening its specialty chemicals business beyond LCDs and electronics into AI servers, in-vehicle electronics, Mini LED, and optical lenses, while also targeting optical...
    Sunday 30 August 2026
    Innodisk says AI demand is lifting margins while memory supply remains tight
    Innodisk said its AI-focused product mix is driving stronger revenue and profitability, a sign that global demand for memory and infrastructure hardware remains robust. The company...
    Friday 28 August 2026
    Humanoid robot demand boosts planetary gear reducers
    Apex Dynamics is optimistic about its business outlook for the second half of 2026, with planetary gear reducers emerging as a key growth driver. The company said its results for the...
    Friday 28 August 2026
    ASIC makers see CSP orders stay strong through 2028
    The four major US cloud service providers (CSPs) have already rewritten their 2026 capital expenditure records, and ASIC vendors are increasingly confident that demand will remain...
    Friday 28 August 2026
    China chip profits jump 18.5-fold on AI demand; advanced-node self-sufficiency seen at 66% by 2035
    China's AI investment boom is translating into sharply higher semiconductor profits while accelerating a longer-term expansion of domestic advanced-node capacity, memory production...
    Friday 28 August 2026
    AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

    The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

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    BIZ FOCUS
    Sep 1, 08:00
    Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
    Monday 31 August 2026
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
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