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Friday 4 September 2026
Taiwan to expand AI compute capacity as supercomputer at research institute hits full load
Taiwan is racing to expand its AI compute capacity as demand for AI chips, GPUs and AI servers surges, with compute infrastructure now central to national competitiveness. According...
Friday 4 September 2026
Ennostar accelerates AI optical communications with micro LED
Ennostar is pushing into AI high-speed optical communications and says Taiwan's full supply-chain ecosystem could bring micro LED into commercial use sooner than expected. Andrew Tsai,...
Friday 4 September 2026
Kyocera completes Nagasaki plant for semiconductor ceramics and packages
Kyocera held a ceremony on September 1 to mark the completion of its Nagasaki Isahaya Plant in Kuremo-machi, Isahaya, Nagasaki. The company says the new manufacturing site will anchor...
Friday 4 September 2026
Taiwan automation specialist Kenmec targets semiconductor packaging plants with low-clearance OHT, AI digital twins
Rising semiconductor packaging and testing demand is exposing space and logistics constraints at existing plants. Kenmec Mechanical Engineering is targeting the upgrade market with...
Friday 4 September 2026
Processor, memory boom could push chip supply chain out of sync, says Yole
Gary Huang, vice president and head of Asia-Pacific research and business development at Yole Group, said the imbalance is already showing signs of what he described as supply-chain...
Friday 4 September 2026
Moonshot AI reportedly files for Hong Kong IPO, targets US$3B
Chinese AI startup Moonshot AI has reportedly filed confidentially for an initial public offering in Hong Kong, potentially setting up one of the city's most closely watched technology...
Friday 4 September 2026
AI boom reshapes DRAM market as Samsung regains lead and CXMT gains ground

The global DRAM market continued its explosive expansion in the second quarter of 2026, as AI infrastructure spending drove demand for...

Friday 4 September 2026
Acer bets on RTX, GoogleBook as on-site AI demand grows
Acer chairman and chief executive Jason Chen said artificial intelligence deployment is already underway, with enterprise customers showing a clear preference for running AI on-site...
Friday 4 September 2026
India PC shipments rise as channel buying lifts second quarter sales
India's PC market grew steadily in the second quarter of 2026, but the gain appears to reflect stocking by retailers, businesses, and distributors as much as end-user demand. The trend...
Friday 4 September 2026
Taiwan to expand industrial land for AI hardware boom
Taiwan's government says it will expand industrial land development to meet surging demand for AI infrastructure hardware, as global suppliers race to add capacity through 2027. Premier...
Thursday 3 September 2026
Infineon sees AI data centers, physical AI as growth drivers
Infineon said the rapid buildout of AI data centers and emerging Physical AI applications could reshape semiconductor demand worldwide. The shift signals higher infrastructure spending,...
Thursday 3 September 2026
Exclusive: China 6-inch SiC substrate supply tightens, prices set to rise
China's 6-inch silicon carbide (SiC) substrate market is undergoing a structural supply-demand reversal. Driven by strengthening downstream demand and limited production restarts,...
Thursday 3 September 2026
Niching validates 500-ton press for large heat spreaders
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
Thursday 3 September 2026
Semiconductor sustainability shifts to cost control as fab resource demand surges

Sustainability is not just good for communities and the environment but also good for business. This is the message from a sustainability...

Thursday 3 September 2026
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...