While major IC packagers have already devoted resources on TSV (via-last) development, Taiwan Semiconductor Manufacturing Company (TSMC) is also eyeing the market with its front-end...
STATS ChipPAC is scheduled to hold an inauguration ceremony for a 12-inch wafer bumping and wafer-level packaging plant in Hsinchu County, northern Taiwan, Thursday (November 17),...
Japan-based DRAM maker Elpida Memory has approved plans to raise up to JPY79.67 billion (US$994 million), including a rights issue and convertible bonds (CBs). The funds raised will...
Elpida Memory on June 27 announced that it has begun sample shipments of its DDR3 SDRAM (x32-bit I/O configuration) made using TSV stacking technology. The sample is a low-power 8Gb...
STATS ChipPAC has expanded its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities, according to the company.
United Microelectronics Corporation (UMC) has acquired NT$561 million (US$19 million) worth of production equipment from subsidiary Hong Bao Technology (transliterated from Chinese),...
Taiwan-based Nanya Technology has teamed up with government-backed Industrial Technology Research Institute (ITRI) to develop a through silicon via (TSV) technology for high-capacity...
Samsung Electronics has announced a lineup of 8GB DDR3 modules developed using 3D chip stacking technology, which is also referred to as through silicon via (TSV). The company claimed...
The Taiwan government-backed Industrial Technology Research Institute (ITRI) has announced the establishment of an experimental lab, which deploys 12-inch wafer through silicon via...
United Microelectronics Corporation (UMC) expects to start sampling integrated 3D IC solutions using 28nm process technology in mid-2011, with volume production slated for 2012, according...
Taiwan Semiconductor Manufacturing Company (TSMC) on June 9 introduced two reference flows - Reference Flow 11.0 and Analog/Mixed Signal (AMS) Reference Flow 1.0 - a day after announcing...
The Suzhou, China plant of Powertech Technology (PTI) has reportedly landed NAND flash backend orders for solid-state drives (SSD) from a Japan-based customer, most likely Toshiba,...
The market for metrology/inspection equipment for 3D through silicon via (TSV) semiconductor packaging looms large, according to The Information Network. The desire for smaller, lighter...
Powertech Technology (PTI) aims to become the number-four IC packaging and testing house worldwide in three years, chairman DK Tsai said at the company's annual banquet on January...
Applied Materials has announced its collaboration with the Taiwan government-backed Industrial Technology Research Institute (ITRI) to accelerate the development and commercialization...
