Applied Materials has announced its collaboration with the Taiwan government-backed Industrial Technology Research Institute (ITRI) to accelerate the development and commercialization...
Leuven, Belgium - September 30, 2009 - IMEC and its 3D integration partners have taped-out Etna, a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D...
Advanced 3D packaging has been adopted in image sensor ICs used in camera lens modules which recently entered volume production, and will be applied into CPUs, baseband ICs, and handset...
United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
Taiwan Semiconductor Manufacturing Company (TSMC) has said it is on track to increase manpower within its R&D and design service units by 30% and 15%, respectively, while proceeding...
Unlike conventional SoC or SiP solutions that integrate ICs on a two-dimensional (2D) surface, using through silicon via (TSV) technology in a package that stacks ICs in a three-dimensional...
Applied Materials and Japan-based Disco have announced a joint effort to develop wafer thinning processes for fabricating through-silicon vias (TSVs) in 3-dimensional (3D) semicond...
Applied Materials has announced that it is undertaking a major effort to enable the widespread adoption of through-silicon vias (TSVs), a rapidly-emerging approach for vertically...
Taiwan's Semiconductor Industry Promotion Office under the Ministry of Economic Affairs (MOEA) and Industrial Technology Research Institute (ITRI) recently gathered experts to discuss...
While Moore's Law continues to march onward, its pace has slowed. Currently, the semiconductor industry is migrating to 32nm, but the migration to 16nm is not expected to arrive until...
BASF is showcasing a range of advanced chemical solutions for the semiconductor industry at the ongoing SEMICON Taiwan 2008 (September 9-11), with solutions for 3D through-silicon...
