As generative AI keeps driving demand for high bandwidth memory (HBM), the global DRAM market landscape is also undergoing changes, with SK Hynix's global DRAM market share exceeding...
The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent allocations...
The AI trend has fueled the high-bandwidth memory (HBM) business opportunities, which in turn has brought attention to related equipment supplier Hanmi Semiconductor. Recently, to...
Although TSMC's 3nm process has already achieved mass production, its capacity utilization rate is not yet filled. Chen Liang-chia, a distinguished professor of the mechanical engineering...
Backend houses including Xintec, ShunSin Technology and Tong Hsing Electronic Industries are expected to post brisker sales results for the second half of 2021 after posting impressive...
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing capacity...
Backend house ASE Technology will have its in-house developed embedded die technology, dubbed "Advanced Embedded Active System Integration (aEASI)," mainly applied to processing automotive...
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module based on high-K metal gate (HKMG) process technology, according to the company.
Powerchip Semiconductor Manufacturing (PSMC), the foundry subsidiary of Powerchip Technology, has announced volume production for AI memory chips using 3D wafer-on-wafer (WoW) tech...
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
SJ Semiconductor (SJSemi), a joint venture between China-based foundry SMIC and backend house JCET, has started implementing its second-phase development looking to strengthen its...
China's top-3 IC backend houses Jiangsu Changjiang Electronics Technology (JCET), Tianshui Huatian Technology and Tongfu Microelectronics (TFME) have seen sales pick up in the second...
SK Hynix has developed HBM2E DRAM product with what it calls the industry's highest bandwidth. The new HBM2E boasts approximately 50% higher bandwidth and 100% additional capacity...
At the ongoing SEMICON China, Advanced Micro-Fabrication Equipment (AMEC) has unveiled its Primo nanova system - the company's first inductively coupled plasma (ICP) etcher for high-volume...
