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NEWS TAGGED TSV
Wednesday 14 March 2018
AMEC intros ICP etcher for advanced memory and logic IC designs
At the ongoing SEMICON China, Advanced Micro-Fabrication Equipment (AMEC) has unveiled its Primo nanova system - the company's first inductively coupled plasma (ICP) etcher for high-volume...
Wednesday 31 January 2018
PTI profits climb to 7-year high in 2017
Memory-IC backend specialist Powertech Technology (PTI) saw its net profits climb to a seven-year high of NT$5.85 billion (US$200.4 million) in 2017.
Friday 14 July 2017
Toshiba develops 3D flash memory with TSV technology
Toshiba has announced development of its BiCS flash three-dimensional (3D) flash memory utilizing through-silicon via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC)...
Friday 2 June 2017
PTI optimistic about memory-dominated packaging
The era of memory-dominated packaging technology has arrived, and heterogeneous stacking with memory and logic devices has become a trend, according to DK Tsai, chairman and CEO for...
Monday 24 August 2015
TSMC stays neutral on ASE's bid for SPIL shares
TSMC would not comment on Advanced Semiconductor Engineering's (ASE) recently-announced bid to take up a major stake in Siliconware Precision (SPIL), according to the contract chip...
Tuesday 21 July 2015
UMC enters volume production for AMD chips using TSV
United Microelectronics (UMC) has entered volume production for AMD's graphics chips using through-silicon-via (TSV) technology, according to the Taiwan-based pure-play foundry.
Monday 25 November 2013
Amkor, Globalfoundries and Open-Silicon partner to develop SoC on 2.5D interposer
Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...
Friday 12 April 2013
ASE breaks ground for new factory buildings in southern Taiwan
Semiconductor assembly and testing company Advanced Semiconductor Engineering (ASE) on April 12 held a groundbreaking ceremony for two new factory buildings, one designated for production...
Wednesday 3 April 2013
Globalfoundries demos 3D TSV capabilities on 20nm
Globalfoundries on April 2 announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At...
Thursday 6 September 2012
SPTS announces dry etch process technology for via reveal applications
SPTS Technologies has announced its dry etch process technology for via reveal applications. Already established as the tool of record at major customer sites, the Pegasus Rapier...
Thursday 6 September 2012
3D IC commercialization to take place in 2015-16, says ASE
The adoption and commercialization of 3D TSV stacking IC technology and products will likely take place in the 2015-16 timeframe, according to Tong Ho-ming, general manager and chief...
Wednesday 5 September 2012
Industry migration to 3D ICs to take place in 2015-16
The industry's gradual migration toward 3D ICs with through-silicon vias (TSV) is unlikely to happen until 2015 or 2016, according to sources at semiconductor companies. Volume production...
Wednesday 29 August 2012
STATS ChipPAC advances TSV capabilities with qualification of mid-end manufacturing
STATS ChipPAC has announced that its through-silicon-via (TSV) capabilities have achieved a new milestone with the qualification of its 300mm mid-end manufacturing operation and transition...
Thursday 19 July 2012
Nanya Technology unveils 8Gb QDP DDR3 based on TSV 3D IC technology
Nanya Technology debuted prototype 8Gb QDP (quad-die package) DDR3 based on in-house-developed via-middle TSV (through silicon via) 3D IC technology at a July 18 investors conferen...
Wednesday 6 June 2012
Singapore IME, UMC team up to develop TSV for BSI sensors
Singapore's Institute of Microelectronics (IME) and United Microelectronics (UMC), the world's second largest foundry company, have announced plans to jointly develop through-silicon...
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Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research