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Wednesday 11 October 2023
Coherent SiC biz to draw investment from Denso, Mitsubishi Electric
Denso and Mitsubishi Electric have agreed to invest an aggregate US$1 billion in Coherent's silicon carbide (SiC) business. The transaction results from the strategic review process...
Monday 2 October 2023
Applied Materials cuts into supply chain for Intel glass substrate technology
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
Thursday 28 September 2023
TSMC talks about new 3Dblox 2.0, 3DFabric achievements
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Tuesday 19 September 2023
Intel gearing up for glass substrate production for advanced packaging
Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.
Wednesday 13 September 2023
Corning's predictions for mainstream display technologies
According to Andrew Ho, general manager of Corning Display Technologies Taiwan, precision glass plays a crucial role in emerging display technologies. In his opinion, LCDs will continue...
Tuesday 12 September 2023
ABF substrate shortage may return in 2024
ABF substrates may experience a reversal from a 5% oversupply in 2023 to a 5–8% shortage in 2024-2025, according to industry sources.
Friday 1 September 2023
Wistron secures major GPU substrate orders for AI servers
Wistron has secured significant GPU substrate orders for AI servers and anticipates its server product shipments will increase month by month for the remainder of this year, according...
Wednesday 30 August 2023
Will PV and LED's boom-and-crash history repeat in SiC semiconductors?
Recent reports from the cross-strait supply chain indicate that a major Chinese new energy vehicle manufacturer had ambitious plans early this year to make significant inroads into...
Tuesday 22 August 2023
Advanced packaging capacity to surge 30–40% in 2024, says TrendForce
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
Tuesday 22 August 2023
Unimicron sees limited impact from factory fire
A fire broke out recently at one of Unimicron Technology's factories in Taoyuan, northern Taiwan. The IC substrate and PCB maker expects the incident to have a limited impact on its...
Friday 18 August 2023
Tape COF substrate suppliers see modest demand pick-up
Tape chip-on-film (COF) substrate suppliers including Chipbond Technology and JMC Electronics have seen a modest increase in demand and are expected to see their operations improve...
Tuesday 15 August 2023
Foxconn grows presence in upstream AI server segment
Contract electronics vendor Foxconn has a sizable share in the upstream AI GPU module and substrate markets of the AI server supply chain, according to company chairman Young Liu.
Friday 4 August 2023
Glass substrates may see tight supply
Glass substrates may see tight supply starting from the third quarter of 2023 till the second half of next year, with major Japanese vendors axing their production despite signs of...
Friday 4 August 2023
IC substrate makers see promising RCC demand prospects
With Apple likely to use resin coated copper (RCC) foil in PCBs for its 2024 iPhone series, IC substrate providers are bullish on RCC demand prospects, according to industry source...
Wednesday 19 July 2023
ABF substrate demand to strengthen in 4Q23
The upcoming M3-equipped Mac series, as well as the demand for AI servers, are likely to drive ABF substrate demand in the fourth quarter of 2023, according to industry sources.