South Korean PCB manufacturer announced its intention to set up a facility in Gujarat as Micron's memory ATMP facility continues to draw semiconductor suppliers to India.
Although the current hot topic is the adoption of AI into PCs, true AI PCs remain a dream, with only Intel's Core Ultra processors, codenamed Meteor Lake, coming close.
The weak end demand since the second half of 2022 has affected the ABF substrate capacity utilization rate of the four major Taiwanese substrate manufacturers: Unimicron, Nanya PCB,...
Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...
Spirox and its subsidiary Southport have unveiled a new SiC substrate testing system, which is now being tested in collaboration with customers such as GlobalWafers and Wafer Works...
Recently, the Japanese semiconductor equipment manufacturer Canon released the nanoimprint lithography (NIL) machine FPA-1200NZ2C, capable of achieving a 5-nanometer process node...
To capitalize on the demand for generative AI, Toppan Holdings (formerly Toppan Printing) reportedly plans to invest approximately JPY60 billion (US$403 million) to expand the production...
The global IC substrate market is poised to decline about 30% in 2023 as ABF substrate demand fails to pick up as anticipated, according to industry sources.
Due to the economic downturn this year, many research firms and enterprises have scaled down sales and financial forecasts for the PCB industry. Some PCB manufacturers have taken...
Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...
Denso and Mitsubishi Electric have agreed to invest an aggregate US$1 billion in Coherent's silicon carbide (SiC) business. The transaction results from the strategic review process...
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
