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AI development lacks breakthrough, says Taiwan AI Academy provost
IT + CE
NEWS TAGGED SPIL
Monday 23 December 2019
China keen on developing AI-based ASICs
Chinese chipmakers are revving up development of HPC (high performance computing) chips for AI and deep learning applications, which are expected to become available for volume production...
Wednesday 27 November 2019
MediaTek intros new-gen 5G SoC
MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from...
Monday 4 November 2019
Taiwan chipmakers gearing up for China 5G rollout
Taiwan-based fabless chipmakers and backend houses are all gearing up to tap robust demand for 5G-related applications from China, where local major telecom carriers have started...
Tuesday 22 October 2019
Taiwan backend supply chain ramps up support for HiSilicon 5G chips
Taiwan semiconductor backend supply chain players are poised to ramp up their shipments and revenues in line with aggressive rollout of diverse 5G chip solutions by major chipmakers,...
Monday 14 October 2019
ASE Technology to see growth momentum carry into 2020
ASE Technology is expected to see its revenues grow quarter by quarter into 2020 thanks to strong packaging demand from major clients including Apple, Huawei's HiSilicon, MediaTek...
Wednesday 2 October 2019
IC backend service providers gearing up for AiP packaging
TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package)...
Wednesday 11 September 2019
ASE to enjoy revenue growth through 4Q19 on SiP orders
IC backend house ASE Technology Holding is expected to generate sequential revenue increases through the last quarter of 2019, driven by orders for SoC chips for smartphones, wearables...
Tuesday 10 September 2019
Chipmakers, partners to gain from robust demand for 5G CPE devices
Global demand for 5G CPE (customer premise equipment) is expected to grow rapidly to 120 million units in 2025 from 100,000 units in 2019, prompting chipmakers such as Qualcomm and...
Monday 2 September 2019
Taiwan firms alter investment deployments due to US-China trade war
The escalating tit-for-tat tariff war between the world's two largest economies has prompted Taiwanese firms with operations in China to return home for investments while also sharply...
Tuesday 20 August 2019
MediaTek 5G SoC on track; Qualcomm faces 7nm EUV yield issues at Samsung, sources say
Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support...
Thursday 1 August 2019
ASE gaining ground in SiP on heterogeneous integration demand
Taiwan's top IC backend specialist ASE Technology Holding has seen its SiP (system in package) business expand substantially so far this year amid growing demand for heterogeneous...
Monday 29 July 2019
Huawei gearing up 5G deployments via 3-pronged approach
Despite suffering hiccups in obtaining advanced 5G base stations chips from US suppliers, Huawei is still aggressively taking a three-pronged approach in carrying out its 5G deployments,...
Wednesday 17 July 2019
ASE Technology to repurchase shares of China subsidiaries from Tsinghua Unigroup
ASE Technology Holding has announced it will buy back the stakes of China-based subsidiaries Siliconware Technology (Suzhou) and Suzhou ASEN Semiconductors it has sold to Tsinghua...
Wednesday 10 July 2019
Order visibility for IC packaging materials clear throughout 3Q19
Clear order visibility for diverse IC packaging materials is seen through the end of the third quarter of the year thanks mainly to increasingly robust demand from OSAT (outsourced...
Friday 28 June 2019
ASE Technology reiterates revenue outlook
ASE Technology Holding has reiterated its revenues outlook this year, but expressed concerns that the escalating US-China trade war could slow technology development and also affect...
Aug 3, 11:10
ADATA Industrial launches industrial-grade DDR5 ECC U-DIMM and ECC SO-DIMM memory modules
Wednesday 27 July 2022
MEAN WELL develops energy-conserving, green energy products to help move towards ESG
Wednesday 27 July 2022
Next-generation controller + multi-power supply: MEAN WELL provides most "usable" solution
Tuesday 26 July 2022
STAr Technologies releases new test software for advanced wafer-level reliability qualification
TSMC Arizona fab nears completion
MacBook series to outshine other PC brands in 2H22
Taiwan foundries intend to hold prices flat
Notebook shipments may slip below 200 million units in 2022
Micron and WD proposes to form memory coalition amid fierce competition with China and Korea
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
Apple to diversify MacBook production in China, says DIGITIMES Research
Chinese smartphone brands see declines in 2Q22, says DIGITIMES Research
Notebook brands to see oversupply of some components in 3Q22, says DIGITIMES Research
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