Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according...

Though TSMC is building advanced wafer fabs in the US, Taiwanese OSAT companies still have concerns about constructing facilities there to provide cutting-edge packaging services...

TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization...