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NEWS TAGGED SIP
Tuesday 5 January 2016
MediaTek unveils new chips for wearables, smart homes and UHD Blu-ray
MediaTek has announced its new chip series for wearable and smart home applications, and Ultra HD Blu-ray players.
Thursday 10 December 2015
ShunSin revenues to see up to 20% growth in 4Q15
ShunSin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, is expected to post revenue...
Wednesday 25 November 2015
China firm reportedly lands SiP device orders from Apple
Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package)...
Tuesday 3 November 2015
ASE to grow revenues from Korea, says company COO
Advanced Semiconductor Engineering (ASE) is looking to grow revenues generated from the market in Korea, where the Taiwan-based IC backend house has invested US$1 billion in building...
Friday 30 October 2015
Brisk SiP shipments buoying EMS operation, says ASE
The average utilization rate of Advanced Semiconductor Engineering's (ASE) IC ATM (assembly test and material) operation is expected to fall 4-6% sequentially in the fourth quarter...
Tuesday 8 September 2015
ASE, SPIL report increased August revenues
IC packaging and testing houses Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have reported sequential increases of 5.8% and 5.7%, respectively,...
Monday 7 September 2015
ASE and TDK launch joint venture
Advanced Semiconductor Engineering (ASE) has announced the official inauguration of ASE Embedded Electronics Incorporated, at a formal signing ceremony in Kaohsiung with TDK and local...
Wednesday 2 September 2015
SPIL looks to effective results of SiP packaging development with Foxconn
Siliconware Precision Industries (SPIL) expects its strategic partnership with Foxconn Electronics for developing SiP (system-in-package) packaging technology to begin bearing fruit...
Monday 31 August 2015
AMICCOM announces Bluetooth Low Energy SiP, named A8107 SiP
AMICCOM, located in Taiwan Hsinchu Science Park, announces new Bluetooth Low Energy product, named A8107SiP. A8107SiP is a silicon-in-package (SiP) product and it includes A8107 and...
Thursday 30 July 2015
ASE expects to post revenue growth through 4Q15
Advanced Semiconductor Engineering (ASE) will manage to post sequential revenue growth through the fourth quarter of 2015, according to company COO Tien Wu.
Friday 26 June 2015
ShunSin revenues to rise starting July
Revenues at ShunSin Technology, a Foxconn subsidiary engaged in the assembly and testing of system-in-package (SiP) modules, are expected to rise substantially in July 2015 thanks...
Wednesday 24 June 2015
IC backend set for tepid growth in 2H15, says ASE COO
The global IC packaging and testing industry has been working through excessive inventory for almost two quarters, but is set for tepid growth in the second half of the year, according...
Friday 5 June 2015
ASE buys new factory buildings for NT$2.5 billion
Advanced Semiconductor Engineering (ASE) has acquired two new factory buildings nearby its operations in the Nantze Export Processing Zone, Kaohsiung, southern Taiwan, for a total...
Monday 1 June 2015
Computex 2015: ASE to showcase SiP solutions
Advanced Semiconductor Engineering (ASE) has announced it will be showcasing system-in-package (SiP) solutions for consumer applications at the Computex Taipei 2015. These SiP applications...
Wednesday 6 May 2015
Dialog, Foxconn SiP subsidiary to invest in Dyna Image
Dialog Semiconductor, which focuses on power management IC solutions, has announced plans to acquire a 40% stake in Taiwan-based Dyna Image, a wholly-owned subsidiary of Lite-On Se...