National Aerospace Fasteners (NAFCO), led by president Alvin Lin, signed a five-year cooperation contract with Germany-based MTU Aero Engines during the 2025 Paris Air Show. The agreement...
As competition intensifies in the high-end memory market, Micron has taken the lead over South Korean competitors by becoming the first memory supplier for Nvidia's next-generation...
Formosa Smart Energy Tech has officially commenced operations of its pilot production line for all-solid-state lithium batteries, marking a significant milestone in the company's...
BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...
As Nvidia prepares to begin supplying samples of its next-generation AI accelerator "Rubin," industry sources report that SK Hynix is accelerating shipments of sixth-generation high-bandwidth...
LG Display announced a planned investment of approximately KRW1.26 trillion (around US$920 million) to boost its OLED technology capabilities and support its ongoing shift from LCD...
On June 18, 2025, Texas Instruments (TI) announced it will invest over US$60 billion in seven semiconductor fabs across the US. This historic investment aims to boost TI's domestic...
Taiwan-based FineMat Applied Materials held its shareholders' meeting on June 17, approving all proposals and outlining its strategic direction amid increasing competition in China's...
Struggling chipmaker Wolfspeed Inc. will be taken over by creditors including Apollo Global Management Inc., under a proposal that would put it into bankruptcy just long enough to...
Dai Nippon Printing (DNP) is set to fully operate its eighth-generation OLED display substrate metal mask factory by the fiscal year 2027, spanning April 2027 to March 2028, with...
AESC Group Ltd., the battery subsidiary of Shanghai-based green tech company Envision Group, has reportedly paused its US expansion plans due to funding constraints, but its existing...
Japanese glass fiber supplier Nitto Boseki (Nittobo) reportedly has raised prices of its composite material products by up to 20% due to increasing costs, but the price hike does...
Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...
Japanese industrial automation giant Yaskawa has announced a US$180 million investment to establish a new production base in Wisconsin, creating the company's first industrial robot...
PCL Technologies has secured a significant laser optical packaging order from Broadcom for its next-generation data center switch chips, signaling a milestone in the commercial rollout...
