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Wednesday 16 July 2025
Nissan to close two plants in Japan; ongoing talks with Foxconn for future transformation
Nissan announced on July 15, 2025, that its Oppama plant will cease production by the end of fiscal year 2027. Vehicle manufacturing operations will be transferred to Nissan Motor...
Wednesday 16 July 2025
Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
Wednesday 16 July 2025
Taiwan Cement launches full investigation into Molicel plant fire
Following the fire that broke out at Taiwan Cement Corporation (TCC) subsidiary Molicel's Kaohsiung plant in the early morning on July 14, TCC chairman Nelson Chang has conducted...
Wednesday 16 July 2025
Goldkey gears up for August IPO as DDR4 demand takes off
A tight supply of DDR4 DRAM has triggered a buying spree. Goldkey Technology chairman Vicky Tseng said that since May and June 2025, DDR4 spot prices have skyrocketed more than 100%,...
Wednesday 16 July 2025
Notebook production holds steady in Southeast Asia as players have no intention of moving to US
The progress of production relocation in the notebook supply chain is holding strong despite the Trump administration's reciprocal tariffs. Brand clients are using a wait-and-see...
Tuesday 15 July 2025
LIPS Corp. lands Samsung, onsemi as partners in 3D vision sensor integration
Taiwan's LIPS Corp., a 3D vision technology company, is moving into mass production after 12 years of research and development and proof-of-concept collaborations. With more than...
Tuesday 15 July 2025
China's expanding robot industry presents opening for Taiwan
Robotics is consistently displaying its potential for success as the industry undergoes a structural transformation. The demand for robotics has grown due to labor shortages and rising...
Tuesday 15 July 2025
Nvidia-MediaTek chip sees demand surge as China seeks alternatives
The GB10 chip co-developed by Nvidia and Taiwan's MediaTek is experiencing demand several times higher than expected as the product nears mass production, according to industry sou...
Tuesday 15 July 2025
Taiwan battery, solar sectors face safety scrutiny amid global expansion push
Taiwan's lithium battery and solar industries are confronting safety challenges that mirror risks seen across international markets, even as the government maintains support for domestic...
Tuesday 15 July 2025
Samsung Display reportedly secures exclusive OLED deals for Apple's first foldable iPhone
Samsung Display is reportedly gearing up to become the exclusive supplier of OLED panels for Apple's first foldable iPhone, signaling a deepening partnership between two of the biggest...
Monday 14 July 2025
Intel cuts jobs at Israel's Fab 28 as new CEO rethinks global footprint
Intel has initiated job cuts at its Fab 28 wafer fabrication plant in Kiryat Gat, Israel, marking the first time the facility—one of the chipmaker's three largest global manufacturing...
Monday 14 July 2025
Exclusive: US drone makers Skydio, Anduril turn to Taiwan for key supply chain support
A wave of next-generation defense contracts from the US Department of Defense is poised to transform the global unmanned systems industry in 2025, and Taiwan may play a pivotal role...
Monday 14 July 2025
BOE pivots beyond displays to glass substrate packaging, perovskite solar
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology...
Monday 14 July 2025
Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

Monday 14 July 2025
Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production
Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory...