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Tuesday 19 August 2025
Samsung to challenge SK Hynix, Micron in Nvidia HBM supply after delays

Samsung Electronics is intensifying its bid to break into Nvidia's high-bandwidth memory (HBM) supply chain after lagging behind SK Hynix...

Monday 18 August 2025
OpenAI's GPT-5 consumes over eight times the power of GPT-4, researchers estimate
OpenAI's latest flagship model, GPT-5, delivers markedly stronger reasoning performance than its predecessor—but at a sharply higher environmental cost. According to a new analysis,...
Monday 18 August 2025
xMEMS Labs Announces 3rd Annual 'xMEMS Live Asia' Seminar Series in Taipei and Shenzhen
xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series,...
Monday 18 August 2025
SK Hynix labor dispute delays Nvidia HBM supply talks
A proposed bonus exceeding KRW100 million (US$72,000) per employee threatens to spark SK Hynix's first full-scale strike, with stalled high-bandwidth memory (HBM) supply talks heightening...
Monday 18 August 2025
Samsung signs DeepX for 2nm process to advance GenAI computing at the edge
Global pioneer in ultra-low-power AI semiconductors, DeepX, has recently become one of Samsung Electronics' foundry clients utilizing its 2nm semiconductor manufacturing process....
Monday 18 August 2025
Intel demonstrates cutting-edge 18A process for non-x86 SoCs, aiming to challenge TSMC
Intel has showcased a non-x86 reference system-on-chip built on its Intel 18A process, underscoring the US chipmaker's commitment to expanding its most advanced manufacturing technology...
Monday 18 August 2025
Strong AI and HPC demand drives Daxin Materials' dual growth engines, ready to expand capacity
Daxin Materials reported solid operational performance in the first half of 2025, with expectations for continued growth in the semiconductor and display materials sectors in the...
Friday 15 August 2025
DeepSeek's R2 stalls as Huawei Ascend chips fall short of Nvidia H100's capabilities
In the 2025 AI arms race, China's DeepSeek has become both a showcase of ambition and a cautionary tale on domestic chip limitations. Founded in Hangzhou in 2023 and backed by hedge...
Friday 15 August 2025
Microsoft, OpenAI push multi-model orchestration despite mixed user feedback
Hybrid AI systems, which automatically switch between multiple AI models based on task requirements, are gaining traction as more AI models become available. Companies such as OpenAI...
Thursday 14 August 2025
Exynos comeback? Samsung nears decision on Galaxy S26 flagship chip strategy
Samsung's Exynos flagship processors may return in the 2026 Galaxy S26 lineup, industry sources say, marking a potential revival after years on the sidelines. Built on Samsung's gate-all-around...
Thursday 14 August 2025
CAMM poised to replace SO-DIMM in high-end notebooks by 2026
Despite the impact of New Taiwan dollar appreciation, connector manufacturer Argosy announced at its earnings call on August 11, 2025, that due to the continued market penetration...
Thursday 14 August 2025
Huawei fast-tracks Mate 80 launch, backed by 10+ key Chinese suppliers in Apple rivalry
Huawei will launch its 2025 flagship Mate 80 series in October, moving up its schedule to land near Apple's iPhone 17 debut in early September, according to supply chain sources....
Thursday 14 August 2025
Ennoconn order backlog exceeds NT$190 billion, 2H25 operations expected to outperform first half
Ennoconn Technologies reported solid financial results in the second quarter of 2025, overcoming an exchange loss of around NT$440 million (approx. US$14.74 million). The company...
Thursday 14 August 2025
Foxconn’s strong quarter sets up its next three big tests
On late August 14, Foxconn is set to deliver an impressive performance for the second quarter of 2025 despite rapid fluctuations in the New Taiwan dollar exchange rate. As Taiwan's...
Thursday 14 August 2025
TSMC integrates CoWoS packaging with Coupe photonics for AI performance boost
Dr. Shang Y. Hou, Director of TSMC's High Performance Packaging Integration Division, delivered a keynote at the OCP APAC Summit 2025. He showcased how the chipmaker is combining...