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Friday 18 July 2025
Rapidus showcases 2nm chip prototypes, eying 2027 mass production
Rapidus, Japan's leading semiconductor company, unveiled its first set of 2nm prototype chips on July 18 during a press event held in Chitose City, Hokkaido. The unveiling took place...
Friday 18 July 2025
TSMC to step up 2nm deployment to meet AI demand
High-tech Innovators are all partnering with TSMC thanks to its industry-leading 2nm and A16 process technologies, which offer a crucial competitive edge in meeting the endless demand...
Wednesday 16 July 2025
LG enters hybrid bonding tool race, challenging Samsung and Hanwha
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
Tuesday 15 July 2025
TSMC in crosshairs: tariffs, currency, and AI growth at stake

As TSMC prepares to deliver its earnings report on July 17, all eyes are on how the world's largest contract chipmaker will navigate...

Monday 14 July 2025
Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

Monday 14 July 2025
Unigroup's US$14 billion comeback: post-restructuring push spans chips, global reach, IPOs
On July 11, 2025, Tsinghua Unigroup marked three years since its strategic overhaul with a strong performance report highlighting its resurgence in China's high-tech sector. Over...
Monday 14 July 2025
Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production
Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory...
Monday 14 July 2025
MediaTek posts 33-month revenue high in June, meets 2Q25 financial target
MediaTek posted a 33-month revenue high of NT$56.43 billion (approx. US$1.92 billion) in June 2025, up 24.91% from the previous month and 30.96% year over year. Overall revenue in...
Monday 14 July 2025
Huawei’s HiSilicon debuts low-power Cat.1 chip to boost IoT reach
On July 10, 2024, Huawei's chip subsidiary HiSilicon launched its first Cat.1 IoT communication chip — the Hi2131 — officially entering the fast-growing cellular IoT market,...
Monday 14 July 2025
JEDEC's LPDDR6 sets new pace for mobile and AI memory with faster, leaner architecture
On July 9, 2025, the JEDEC Solid State Technology Association, the leading organization for microelectronics standards, introduced LPDDR6 (JESD209-6), its latest low-power DRAM specification...
Friday 11 July 2025
AI-powered NPU race spurs growth for test interface companies
As the global smartphone application processor market undergoes a major shift toward AI-driven performance, chip giants like MediaTek and Qualcomm are ramping up efforts to dominate...
Friday 11 July 2025
Niching sees stellar 2Q25 results from AI, HPC, and advanced packaging applications
Materials supplier Niching is aiming to hit record-high revenue this year after strong performance in the first half of 2025, boosted by continued growing demand in the AI, high performance...
Thursday 10 July 2025
Samsung's foldable focus on high-end smartphones sparks chipmaker optimism
Samsung Electronics has introduced its latest flagship foldable smartphones, adding fresh momentum to what is shaping up to be a pivotal year for the foldable device market. While...
Thursday 10 July 2025
Phison 2Q25 revenue hits record as NAND controller shipments surge
NAND flash manufacturers have been implementing production cuts, leading to urgent orders to surge and leaving a supply shortage for NAND controllers. Phison CEO K.S. Pua explained...
Wednesday 9 July 2025
Sysgration sees 12% YoY surge in June revenue from new product lines
Sysgration posted NT$282 million (approx. US$9.7 million) in consolidated revenue for June 2025, marking year-over-year and month-over-month improvements of 12.83% and 5.65% respectively,...