MediaTek announced on September 16, 2025, that it has completed the tape-out of its first flagship system-on-chip (SoC) using TSMC's 2nm process, becoming one of the earliest adopters...
Qualcomm has introduced its latest flagship mobile platform, the Snapdragon 8 Elite Gen 2, built using TSMC's 3nm process and incorporating a customized Oryon core to deliver improved...
Acer has teamed up with Nvidia to debut the Veriton GB100, a compact AI workstation built on Nvidia's GB10 chip. The model has generated strong demand from clients even before its...
Coretronic and Radiant Opto-Electronics recorded revenue increases in August compared to July, though their year-over-year performances show declines. Looking ahead to the third quarter...
Nvidia is preparing a potential shake-up in the AI semiconductor memory market with the introduction of its next-generation AI processor, Rubin CPX, which is designed for large-context...
AI giants are shifting the global competition in large language models (LLMs) away from benchmark dominance toward sustainability and real-world applicability, signaling a new phase...
Topview Optronics, a subsidiary of Taiwan's Qisda Group, reported that integration efforts in the security control industry are gaining momentum. While customers previously focused...
Arm unveiled its Lumex Compute Subsystem (CSS) on September 10 at the Unlocked Summit in Shanghai, signaling its boldest step yet to elevate AI and gaming on flagship smartphones...
Japanese chip testing equipment giant Advantest has overtaken Tokyo Electron (TEL) in market capitalization for the first time in nearly two decades, signaling a shift in the balance...
OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console...
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
Apple has introduced its self-developed vapor chamber (VC) cooling technology for the first time in the iPhone 17 Pro series, aiming to maintain high performance during extended use...
