TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
Memory packaging and testing company ChipMOS faced a net loss of NT$533 million (US$17.8 million) after tax in the second quarter of 2025, impacted by rising overall costs and New...
Samsung Electronics is reportedly investing JPY25 billion (approx. US$170 million) to set up an advanced packaging research institute in Yokohama and acquire a major office tower...
Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible...
China's semiconductor industry posted CNY455 billion (approx. US$63.3 billion) in total investment during the first half of 2025, down 9.8% from a year earlier, according to a new...
Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
India has approved four additional semiconductor projects under the India Semiconductor Mission (ISM), further strengthening the country's semiconductor manufacturing ecosystem. These...
Taiwan Semiconductor Manufacturing Company (TSMC) held a board meeting on August 12, during which several key resolutions were made. Of particular interest was the approval to increase...
ASE Technology Holdings, a leading global semiconductor assembly and testing company, will invest approximately NT$6.5 billion (US$217 million) to purchase a factory and related facilities...
SJ Semiconductor (Jiangyin) Corp. (SJ Semi), a major packaging and testing partner of Huawei's chip design arm HiSilicon, has received domestically developed back-end steppers from...
Samsung Electronics will build a CMOS image sensor (CIS) production line at its Austin, Texas, semiconductor facility for Apple's next-generation iPhones, but the chips' back-end...
Taiwan Semiconductor Manufacturing Co. (TSMC) has undergone a reorganization of its advanced packaging capacity and workforce, even as it publicly emphasizes expansion efforts. The...
Taiwanese memory chipmakers are intensifying efforts to capture growth in customized AI applications, unveiling low-power, high-bandwidth alternatives to High Bandwidth Memory (HBM)...
