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Friday 6 June 2025
The AI chip wars: ASIC uprising challenges Nvidia's crown as TSMC takes all
As Nvidia tightens its near-monopoly grip on the AI GPU market, tech giants and chipmakers are accelerating efforts to develop and mass-produce ASICs, signaling a brewing showdown...
Thursday 5 June 2025
Hanmi Taiwan posts record growth as demand for maintenance services and component sales surge
Hanmi Taiwan, the local subsidiary of South Korea's Hanmi Semiconductor, reported explosive growth in the first quarter of 2025, generating 76% of its entire 2024 revenue in just...
Thursday 5 June 2025
SpaceX eyes FOPLP as Washington pushes chip packaging reshoring
Market sources report that SpaceX, the low-earth orbit satellite giant founded by Tesla CEO Elon Musk, is accelerating its expansion into fan-out panel-level packaging (FOPLP). The...
Wednesday 4 June 2025
CoWoS material shortage triggers AI supply chain concerns; TSMC and ASE expected to receive priority access
As the surge in demand for high-performance computing (HPC) chips driven by artificial intelligence (AI) continues, the semiconductor industry has reported that Japanese chemical...
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
Wednesday 4 June 2025
ASE bets on new chip tech to handle AI’s rising power and speed needs
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
Chip packaging material shortage deepens as top supplier raises prices 20%
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Monday 2 June 2025
Applied Materials reportedly partners with Absolics in glass substrate
Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment...
Monday 2 June 2025
Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Monday 2 June 2025
AIchip goes all in on CoWoS advanced packaging
Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
Thursday 29 May 2025
Hanmi Semiconductor wins US$5.8 million ASE supply contract
Hanmi Semiconductor has secured a major supply agreement with Taiwan's ASE Technology Holding Co., marking another strategic win in its global expansion drive. Under the contract,...
Tuesday 27 May 2025
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
Tuesday 27 May 2025
FOCI advances 1.6T optical module validation as LPO and CPO poised to coexist
As data transmission and exchange volumes skyrocket, high-speed connectivity has emerged as a defining trend in the tech landscape. FOCI Fiber Optic Communications, a leading player...
Tuesday 27 May 2025
Malaysia bets on advanced chip design to power US$270 billion semiconductor ambition
Southeast Asian nation pivots from assembly hub to IC design powerhouse amid global supply chain tensions, but faces talent and scaling challenges