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Thursday 9 October 2025
Applied Materials advances AI chip performance with hybrid bonding and e-beam metrology
To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing...
Thursday 9 October 2025
Commentary: China's TGV ambitions face an uphill battle
China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
Thursday 9 October 2025
Glass substrate TGV: China's edge to capture AI HPC packaging
China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
Thursday 9 October 2025
Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP
SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
Thursday 9 October 2025
IMPACT 2025: Asia's Largest Packaging & PCB Event in the AI Era
The IMPACT Conference, Asia's largest international event on advanced packaging and circuit boards, will celebrate its 20th anniversary this year at Nangang with its biggest program...
Wednesday 8 October 2025
China and Taiwan chart diverging paths in the 12-Inch SiC market
In the high-stakes arena of silicon carbide (SiC) innovation, a quiet transformation is underway. While much attention has focused on non-Chinese supply chains entering advanced packaging...
Wednesday 8 October 2025
ITRI targets AI chiplet and SiPh in 2026 semiconductor R&D push
Taiwan's Ministry of Economic Affairs (MOEA) has approved a NT$160 million (US$5.27 million) allocation from a contingency fund to support the Industrial Technology Research Institute...
Wednesday 8 October 2025
The second life of DDR4: how an old memory standard is driving a new upcycle
DDR4 memory is experiencing a sharp rise in both price and volume due to tight supply, driving strong inventory replenishment momentum. This has rapidly heated up orders across the...
Wednesday 8 October 2025
With Intel partnership, Nvidia raises stakes in processor war

Recent market developments—such as Nvidia's capital infusion into Intel and AMD's approach to Intel for packaging deals—have...

Wednesday 8 October 2025
India approves NaMo Semiconductor Lab at IIT Bhubaneswar
Union Minister for Electronics and Information Technology Ashwini Vaishnaw has approved the establishment of the NaMo Semiconductor Laboratory at the Indian Institute of Technology...
Tuesday 7 October 2025
Upstream substrate and leadframe price hikes pressure IC packaging costs
Since early 2025, rising costs of precious metals such as gold and silver have triggered price increase signals in the supply chain for key materials like substrates and leadframes...
Tuesday 7 October 2025
Taiwan's silicon shield under siege as US accelerates chip onshoring
A US proposal to evenly split advanced semiconductor production between Taiwan and the United States has sparked deep concern in the industry and triggered a political debate in Taipei,...
Monday 6 October 2025
India roundup: Number of Apple suppliers in India likely reaches 45
Despite bottlenecks, including culture, Taiwan-India bilateral ties are expanding. The number of Apple suppliers in India is likely to reach 45 amid production diversification.
Monday 6 October 2025
Indian state courts SK Hynix with investment proposal amid global expansion plans
The government of Andhra Pradesh is stepping up efforts to attract SK Hynix, one of the world's leading memory chipmakers, to establish a facility in India. According to The Deccan...
Monday 6 October 2025
Amkor breaks ground on Arizona packaging facility near TSMC
US-based semiconductor packaging and test services provider Amkor Technology announced it will hold a groundbreaking ceremony on October 6, 2025, to officially begin construction...