News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Thursday 26 June 2025

IC distributors pivot to Southeast Asia under trade turbulence

With US-China tariff tensions intensifying and global manufacturers racing to decentralize their supply chains, Southeast Asia is emerging...

Thursday 26 June 2025

TSMC, ASE close ranks on PLP, 310x310mm emerges as the format to watch

Taiwanese chipmakers TSMC and ASE Holdings are quietly positioning themselves at the forefront of panel-level packaging (PLP), an emerging advanced packaging format poised to succeed...

Thursday 26 June 2025

ASE group Chair's daughter joins board, fuels succession rumors

ASE Technology Holding Co., the world's largest provider of semiconductor packaging and testing services, convened its annual shareholders' meeting on June 25, 2025, approving key...

Thursday 26 June 2025

SK Hynix expands DRAM dominance with new chip packaging plant in South Korea

SK Hynix said it plans to construct a new semiconductor backend facility in Cheongju, North Chungcheong Province, marking its seventh such plant in South Korea, as the company moves...

Thursday 26 June 2025

ASE’s COO bets on Taiwan’s AI strength, calls TSMC’s U.S. push decisive

Tien Wu, chief operating officer of ASE Technology, said the company has no plans to revise its full-year capital spending despite mounting geopolitical tensions and tariff pressures...

Thursday 26 June 2025

Chinese chip giants multiplying subsidiaries in race for supply chain control

Amid rising US-China tech tensions and growing supply chain risks, China's top semiconductor companies are rapidly forming new subsidiaries...

Wednesday 25 June 2025

Foxconn develops lighter AI solve to Vision Pro weight issues, unveils semiconductor breakthroughs

Foxconn highlighted Vision Pro's hardware hurdles at an NCHC event, unveiling AI-driven semiconductor innovations to enable lighter AR glasses. The company also outlined efforts in...

Monday 23 June 2025

TSMC advanced packaging gains traction with Apple, Nvidia orders

Advanced packaging continues to gain momentum, with the industry closely watching as TSMC not only secures large orders from Nvidia but also sees Apple joining the fray, clearly signaling...

Friday 20 June 2025

Taiwan chip packaging sector faces triple threat as Trump tariff deadline looms

Taiwan's semiconductor packaging and testing companies confront three major operational challenges in the second half of 2025 as US President Donald Trump's reciprocal tariff suspension...

Friday 20 June 2025

Samsung bolsters 2nm foundry push with EDA partnerships amid yield concerns

Samsung Electronics is strengthening partnerships with electronic design automation (EDA) and intellectual property providers to boost the competitiveness of its 2nm foundry process...

Friday 20 June 2025

Micron challenges South Korean rivals with SOCAMM breakthrough and PTI support

As competition intensifies in the high-end memory market, Micron has taken the lead over South Korean competitors by becoming the first memory supplier for Nvidia's next-generation...

Thursday 19 June 2025

New front opens in CPO, SiPh race: TSMC and Taiwanese supply chain in the lead

Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting...

Thursday 19 June 2025

Urgent orders boost memory packaging and testing in 2Q25; AI stabilizes variables for 2H25

Benefiting from a rapid recovery in memory market demand during the first half of 2025, memory packaging and testing companies are sharing in the gains. Although the US 90-day tariff...

Thursday 19 June 2025

BOE ventures into advanced packaging with glass substrate pilot production line

BOE is advancing its semiconductor glass core substrate (GCS) business. According to South Korean media reports, BOE recently procured equipment for a GCS packaging R&D pilot...

Wednesday 18 June 2025

Samsung advances 4nm chiplet technology to boost AI chip foundry position

Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...

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