Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
The CPCA Show Plus 2025, one of Asia's largest printed circuit board (PCB) exhibitions, opened on October 28, 2025, in Shenzhen, drawing hundreds of global electronics manufacturers...
Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service...
At the Boom-Up Festival 2025, one of Korea's largest gatherings of startups and investors, WOW Future Tech CEO Munju Kim drew attention with an unconventional idea: building drones...
Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC),...
To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production...
The development of artificial intelligence (AI) chips has brought the printed circuit board (PCB) and semiconductor industries closer together. Zhen Ding Technology chairman Charles...
Silicon transistors are approaching their physical limits, and AI is increasing demand for higher density, performance, and energy efficiency. Advanced packaging and bonding technologies...
As artificial intelligence (AI) and high-performance computing (HPC) lead a new industrial revolution in the PCB sector, Taiwanese giants Zhen Ding Tech (ZDT) and Unimicron are optimistic...
Tongtai and Contrel are focusing on the convergence of semiconductors and PCBs in advanced TGV packaging. Taiwanese companies aim to lead in this area, as Tongtai seeks profitability...
