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    Is the AI boom really a bubble? Jensen Huang isn’t convinced
    11h 37min ago
    Taiwan's foundry industry remains irreplaceable with strong export growth in October 2025
    11h 37min ago
    Huawei drives Shenzhen to become China's second largest IC design hub in 2025
    11h 37min ago
    What does Wei-ren Luo wants to achieve in his return to Intel?
    11h 37min ago
    Apple increased A19 chip orders by 5 million units, prompting TSMC to adjust capacity
    11h 37min ago
    Supply chain disruption from Nexperia issue boosts chip orders for Taiwanese suppliers
    11h 37min ago
    NEWS TAGGED PACKAGING
    Thursday 20 November 2025
    Ligitek Electronics to invest in silicon photonics in cleanroom facilities with government support
    Taiwan-based LED manufacturer Ligitek Electronics announced plans to enter the silicon photonics (SiPh) sector, investing tens of millions of New Taiwan dollars in cleanroom equipment...
    Thursday 20 November 2025
    ASML expands into advanced CoWoS packaging with new I-line system
    Kuan-Cheng Hsu, ASML's Taiwan and Southeast Asia customer marketing head, highlighted that AI-driven semiconductor demand is entering its strongest growth cycle ever, accelerating...
    Thursday 20 November 2025
    Nvidia partners with Amkor, SPIL, and Menlo Micro to boost US IC backend capacity
    Nvidia has announced key partnerships to expand its supply chain and manufacturing capacity in the US, aiming to meet rising global demand for artificial intelligence (AI) computing...
    Thursday 20 November 2025
    Amkor invests US$177M to expand AI chip packaging in South Korea
    Amkor, one of the largest US-based outsourced semiconductor assembly and test (OSAT) providers, has begun investing over KRW260 billion (approx. US$177 million) in South Korea to...
    Wednesday 19 November 2025
    Global semiconductor IDM investment in ASEAN

    Introduction

    Tuesday 18 November 2025
    Panjit acquires Torex Vietnam to boost global packaging and testing capacity
    Panjit International has approved the use of US$10.03 million of internal funds to acquire a 95% stake in Torex Vietnam Semiconductor (Torex Vietnam), a subsidiary of Torex Semiconductor,...
    Tuesday 18 November 2025
    Panjit's MOSFET becomes top 3Q25 revenue contributor
    Power semiconductor integrated device manufacturer (IDM) Panjit International has announced its consolidated financial results for the third quarter of 2025. Although quarterly revenue...
    Tuesday 18 November 2025
    PGC Strengthens Cloud and AI ASIC Acceleration with Synopsys' Next-Generation Interface and Memory IP on Advanced Nodes

    As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid...

    Tuesday 18 November 2025
    OSE plans price hikes and capacity expansion as memory market tightens
    Orient Semiconductor Electronics (OSE) said the global memory industry has shifted decisively into a "seller's market," prompting the company to pass higher costs to customers and...
    Monday 17 November 2025
    Hiwin Mikrosystem secures strong semiconductor advanced packaging orders
    Hiwin Mikrosystem, leveraging years of expertise in nanometer-level high-precision positioning platforms and direct-drive motors, has successfully penetrated the semiconductor and...
    Monday 17 November 2025
    TSMC accelerates CoPoS mass production to 2029, Taiwan suppliers win first orders
    The market is focusing on rising demand for Nvidia AI GPUs and various ASICs, with optimism growing as TSMC plans to expand its CoWoS capacity and sees OSAT partners joining the race...
    Monday 17 November 2025
    Weekly news roundup: Musk advances US chip-fab plans; SpaceX shifts industry economics; memory shortages continue into 2026
    These are the most-read DIGITIMES Asia stories in the week of November 10 to November 16, 2025.
    Monday 17 November 2025
    GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

    Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...

    Monday 17 November 2025
    India roundup: India's Kaynes Semicon outlines OSAT roadmap from power to advanced packaging
    Kaynes Semiconductor is looking to expand into IC backend businesses as Kaynes Technologies' EMS business faces uncertainties due to US tariffs.
    Sunday 16 November 2025
    Semco eyes big tech deals in the glass substrate boom
    Samsung Electro-Mechanics (Semco) is reportedly in supply talks with several Big Tech companies, two years after moving into glass substrates. Seen as a next-generation breakthrough...
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