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NEWS TAGGED PACKAGING
Wednesday 29 October 2025
Unified packaging standards seen as key to meeting AI and automotive demands
Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
Wednesday 29 October 2025
Intel shifts assembly and testing to Vietnam, plans tech talent recruitment
Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
Wednesday 29 October 2025
Commentary: Lessons from Arm China and Nexperia’s unraveling

Over the past decade, China's tech sector has surged across chip design, foundry, and packaging. Yet beneath the slogan of "technological...

Wednesday 29 October 2025
Powertech secures full FOPLP bookings ahead of US$1B expansion
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Wednesday 29 October 2025
Hanmi eyes AI chip packaging amid HBM market challenges
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
Wednesday 29 October 2025
CPCA Show Plus 2025: China's PCB industry rallies around the AI boom
The CPCA Show Plus 2025, one of Asia's largest printed circuit board (PCB) exhibitions, opened on October 28, 2025, in Shenzhen, drawing hundreds of global electronics manufacturers...
Wednesday 29 October 2025
Intel's 18A and advanced packaging boost Taiwanese IP design firms
Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service...
Tuesday 28 October 2025
Korean startup builds cardboard drones, deploys pollution trackers for combat and environmental monitoring
At the Boom-Up Festival 2025, one of Korea's largest gatherings of startups and investors, WOW Future Tech CEO Munju Kim drew attention with an unconventional idea: building drones...
Tuesday 28 October 2025
Hon Precision ramps AI GPU and ASIC testing equipment with orders through 1H26
Semiconductor IC testing equipment manufacturer Hon Precision has, in recent years, successfully entered high-power application markets such as AI, high-performance computing (HPC),...
Tuesday 28 October 2025
SK Hynix M15X completion expected by end of 2025
To meet the growing demand for HBM, SK Hynix is accelerating the construction of its DRAM production base, M15X plant in Cheongju, South Korea. According to Yonhap News and...
Monday 27 October 2025
LG Electronics advances HBM and glass substrate equipment for advanced packaging
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production...
Monday 27 October 2025
Taiwan’s PCB makers enter ‘AI moment’ as complexity nears semiconductor levels
The development of artificial intelligence (AI) chips has brought the printed circuit board (PCB) and semiconductor industries closer together. Zhen Ding Technology chairman Charles...
Friday 24 October 2025
Samsung CTO: Cross-disciplinary collaboration key to semiconductor innovation
Silicon transistors are approaching their physical limits, and AI is increasing demand for higher density, performance, and energy efficiency. Advanced packaging and bonding technologies...
Thursday 23 October 2025
Taiwan's ZDT and Unimicron forecast golden decade for PCB industry on AI boom
As artificial intelligence (AI) and high-performance computing (HPC) lead a new industrial revolution in the PCB sector, Taiwanese giants Zhen Ding Tech (ZDT) and Unimicron are optimistic...
Thursday 23 October 2025
Taiwanese firms poised to lead TGV process equipment amid semiconductor-PCB integration
Tongtai and Contrel are focusing on the convergence of semiconductors and PCBs in advanced TGV packaging. Taiwanese companies aim to lead in this area, as Tongtai seeks profitability...