CONNECT WITH US
NEWS TAGGED PACKAGING
Friday 18 July 2025
Malaysia's road from foreign capital to homegrown innovation
Malaysia's semiconductor industry traces back to the 1970s. In August 1972, Malaysia's first free trade zone, the Bayan Lepas Free Industrial Zone (Bayan Lepas FIZ), was launched in...
Friday 18 July 2025
SK Key Foundry, LB Semicon announce next-gen packaging tech for auto semiconductors
South Korean foundry SK Key Foundry and semiconductor packaging and testing specialist LB Semicon have jointly developed "Direct RDL," a key semiconductor packaging technology that...
Thursday 17 July 2025
Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging...

Thursday 17 July 2025
Beyond Arizona: TSMC’s next big bet may be in rural Taiwan
Taiwan Semiconductor Manufacturing Co. (TSMC) has reiterated its commitment to growing semiconductor production in Taiwan, despite increasing investments in the US. Supply chain sources...
Wednesday 16 July 2025
LG enters hybrid bonding tool race, challenging Samsung and Hanwha
LG Electronics is making a bold push into the high-end semiconductor equipment market, setting its sights on hybrid bonding (HB) tools, critical for producing next-generation high-bandwidth...
Wednesday 16 July 2025
Penang's OSAT boom: ASE, Tongfu, Inari lead charge in advanced packaging
Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...
Tuesday 15 July 2025
GlobalFoundries takes MIPS under its wing; Imagination shoots down SMIC takeover talk
With TSMC commanding the lion's share of foundry orders for data center AI accelerators, second-tier players like UMC, GlobalFoundries (GF), and SMIC are urgently repositioning to...
Tuesday 15 July 2025
Broadcom's plant investment in Spain reportedly canceled, dealing blow to Southern Europe's chip ambitions
Broadcom has reportedly scrapped its plan to invest US$1 billion in an assembly, test, and packaging (ATP) facility in Spain. Reuters and Europa Press cited insiders...
Monday 14 July 2025
Keysight sees AI chip boom driving verification market growth
Keysight Technologies expects AI and 6G networks to fuel structural growth in the semiconductor verification market that will outpace industry capital expenditure increases, according...
Monday 14 July 2025
BOE pivots beyond displays to glass substrate packaging, perovskite solar
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology as...