CONNECT WITH US

ASE unveils AI-enhanced IDE 2.0 to accelerate chip design and packaging

Flora Wang, Taipei; Jingyue Hsiao, DIGITIMES Asia 0

Credit: DIGITIMES

ASE has announced a significant upgrade to its in-house integrated design ecosystem (IDE) platform, introducing IDE 2.0, which features AI integration to speed up design iterations and optimize chip-package interaction (CPI) analysis. The improvement...

The article requires paid subscription. Subscribe Now