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Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp

Monica Chen, Hsinchu; Levi Li, DIGITIMES Asia Friday 15 August 2025 0

Credit: DIGITIMES

TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration called Chip-on-Panel-on-Substrate, or CoPoS. The platform merges...

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