Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate...
Wise Integration, a pioneer in digital control for gallium nitride（GaN）and GaN IC-based power supplies, today announced the appointment of Ghislain Kaiser as Chief Executive Officer...
The modern digital supply chain is no longer a traditional linear sequence but a complex, interconnected ecosystem of suppliers, sellers, logistics providers, and customers. While...
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled...
Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented,...
The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is...
Hybrid work is reshaping the way organizations train their people. The new reality requires a balance of efficiency and flexibility, as organizations strive to achieve easy access...
OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console...
Taiwan has taken a notable step in corporate digital asset strategy. WiseLink, a Taiwan-listed fintech and SaaS provider, has led a $10 million funding round for Top Win International,...
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this soluti...
As digital infrastructure becomes the backbone of today's enterprises and cloud services, servers have transformed far beyond their original role as mere computing units. They now...
Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots...
In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply...
The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making...
