As AI workloads scale across global cloud infrastructure, chip designers face a persistent challenge: balancing compute throughput, bandwidth, and power efficiency amid...
Robust computational capabilities are fueling the rapid evolution of artificial intelligence (AI) applications. The rise of large language models (LLMs) such as ChatGPT-5...
Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...
The rise of generative AI is accelerating digital transformation across traditional industries, and the construction sector is no exception. In an industry long dependent...
As Taiwan faces demographic challenges from a declining birthrate, the food and beverage (F&B) industry is struggling with severe labor shortages. While digital...
Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial...
Empowered by the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC), eNeural is redefining the landscape of edge AI with two flagship innovations - AI-Craft,...
As businesses face dramatic changes in the global market environment, companies worldwide are accelerating their digital transformation efforts, seeking competitive...
HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...
Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise...
Fonontech B.V. is a device solution provider and startup company based on Impulse Printing technology. Impulse printing technology can be described as a novel additive...
HITEC Power Protection develops, manufactures, and provides dynamic uninterruptible power (UPS) solutions to support the most vital of manufacturing and business critical...
Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking...
Tempress is a leading manufacturer of diffusion and thin film deposition equipment, with over 55 years of experience in thermal process technology. We support innovators...
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry...
