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NEWS TAGGED NEWS HIGHLIGHTS
Friday 12 September 2025
OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
OneXPlayer unveiled its annual flagship 3-in-1 AI PC—the X1 Air, a versatile smart terminal that seamlessly transforms between a tablet, mini notebook, and handheld gaming console...
Friday 12 September 2025
WiseLink Announces $10M Bitcoin Allocation as Part of Treasury Strategy in Asia
Taiwan has taken a notable step in corporate digital asset strategy. WiseLink, a Taiwan-listed fintech and SaaS provider, has led a $10 million funding round for Top Win International,...
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
Thursday 11 September 2025
SK hynix begins supplying mobile NAND solution ZUFS 4.1
SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this soluti...
Wednesday 10 September 2025
How Flash Memory Shapes Server Security: From Firmware Integrity to Root of Trust
As digital infrastructure becomes the backbone of today's enterprises and cloud services, servers have transformed far beyond their original role as mere computing units. They now...
Wednesday 10 September 2025
C SUN taps into AI packaging boom, diversifies applications to fuel next decade of growth
Taiwan-based advanced packaging equipment provider C SUN Manufacturing, Ltd. (TWSE: 2467), now in its 60th year, is undergoing a critical transformation as it expands from its roots...
Wednesday 10 September 2025
3S will unveil AI empowered formic acid reflow oven for high reliability power module assembly, redefining green, flux-free, low void rate soldering
In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply...
Tuesday 9 September 2025
PBA released their latest nano-precision dual gantry stage platform series for heterogeneous semiconductor advanced packaging and metrology equipment
The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making...
Tuesday 9 September 2025
Chroma to showcase advanced AI chip test solutions at SEMICON Taiwan 2025
Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips,...
Tuesday 9 September 2025
Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
ADLINK Technology Inc., a global leader in edge computing solutions, introduces the cExpress-R8, a COM Express COM.0 R3.1 Type 6 Compact module powered by AMD Ryzen Embedded 8000...
Monday 8 September 2025
Holtek launches its new electric two-wheeler solution; drives green travel innovation
In the face of global challenges such as traffic congestion, air pollution, and rising oil prices, electric two-wheelers are rapidly becoming an important transportation choice due...
Monday 8 September 2025
TerraONE Technology Becomes Official Distribution Partner for Wasabi Technologies
TerraONE Tech Co., Ltd., a company specializing in modern IT solutions, has announced a strategic partnership with Wasabi Technologies, a leading cloud storage company, becoming the...
Monday 8 September 2025
From cyclical swings to structural growth: Join GMIF2025 to unlock new opportunities for memory in the AI Wave
In the past decades, the memory industry has been one of the most volatile sectors in semiconductors, marked by price fluctuations, supply-demand imbalances, and rapid capacity shifts...
Friday 5 September 2025
Lotus Microsystems and EDOM Technology Form Strategic Distribution Partnership to Expand Presence Across APAC
Lotus Microsystems ApS, a power management solutions company, and EDOM Technology, one of the Top 10 Global Distributors, jointly announced the signing of a strategic distribution...
Wednesday 3 September 2025
Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has...