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Niching expects vapor chamber sales to rise 50% in 2024
Dec 5, 22:59
Quartz component maker TXC bullish on automotive and AI demand
Dec 5, 22:43
Smartphone lens module suppliers brace for specs war
Dec 5, 19:56
Notebook market expanding in Middle East, says Acer executive
Dec 5, 19:22
NEWS TAGGED LOW-POWER
Monday 4 December 2023
E Ink and AUO innovate smart healthcare: low-power e-paper and Chinese medicine innovations
AUO and E Ink, major players in the information communication technology (ICT) sector, have ventured into the healthcare system with their innovative solutions that aim to innovate...
Wednesday 25 October 2023
Micron collaborates with Qualcomm to accelerate generative AI
Micron Technology has announced that production samples of its low-power double data rate 5X (LPDDR5X) memory, which the company claims is the industry's only 1-beta mobile-optimized...
Friday 25 August 2023
Montage, H3C team up for CXL storage technology
Montage Technology, a Chinese manufacturer of memory interface devices and PCIe retimer chips, is collaborating with H3C, a Tsinghua Unigroup-affiliated company, to promote Compute...
Monday 29 May 2023
Ayar Labs raises another US$25 million in latest funding round
Ayar Labs has completed Series C1 funding, raising an additional US$25 million to bring its total Series C funding to US$155 million, according to the US-based silicon photonics chip...
Wednesday 29 March 2023
UMC, eMemory expand low-power memory solutions for AIoT and mobile markets with 22nm RRAM qualification
Silicon IP provider eMemory and pure-play foundry United Microelectronics (UMC) have announced that eMemory's resistive random access memory (RRAM) IP has been qualified on UMC's...
Monday 6 March 2023
Top 3 memory vendors account for three-fourths of leading-edge wafer capacity
According to Knometa Research, Samsung Electronics, Micron Technology, and SK Hynix held 76% of the leading-edge capacity at the end of 2022, with the majority of it going toward...
Friday 10 February 2023
GF acquires Renesas' non-volatile resistive RAM technology
GlobalFoundries (GF) has announced the acquisition of Renesas Electronics' proprietary and production-proven conductive bridging random access memory (CBRAM) technology, a low-power...
Friday 23 December 2022
Nordic Semiconductor showcases leading Bluetooth LE, Matter, low-power Wi-Fi, and cellular IoT technology at CES 2023
Nordic Semiconductor will bring its full portfolio of wireless IoT products to CES 2023 on booth 52039 at the Venetian Expo. Highlights on the booth will include the company's Matter...
Wednesday 25 May 2022
Global top-3 DRAM makers hold 94% of 2021 market
Samsung Electronics, SK Hynix and Micron Technology held a combined 94% share of the global DRAM market in 2021, with Samsung and SK Hynix collectively taking up 71.3% of the market,...
Wednesday 5 January 2022
Low-power chips to bridge metaverse gap, says NXP Greater China chairman
There has been a large gap between imagination and realization when it comes to the metaverse, according to Ting Wei Li, chairman of NXP Greater China. However, nowadays, Li says...
Wednesday 1 December 2021
Samsung intros new logic solutions to power next-gen automobiles
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Tuesday 23 November 2021
MediaTek validates Micron LPDDR5X for flagship 5G smartphone SoC
MediaTek has validated Micron Technology's low-power double data rate 5X (LPDDR5X) DRAM for MediaTek's new Dimensity 9000 flagship chipset for 5G smartphones, according to Micron.
Friday 20 August 2021
Intel unveils new chip architectures; expands partnership with TSMC
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
Wednesday 11 August 2021
Samsung intros 5nm processor for wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Thursday 21 November 2019
Intel unveils Tremont microarchitecture
Wednesday 9 December 2015
Samsung 128GB TSV DDR4 RDIMM
Dec 5, 10:56
PowerArena uncovers human factors causing production line bottlenecks, boosting productivity and quality
Monday 4 December 2023
Turn your website traffic into money: the all-in-one system for online course
Friday 1 December 2023
BIWIN packaging and testing center achieves IATF 16949 recognition
Friday 1 December 2023
Avilon solar panel inspection in Thailand
TSMC likely to win it all, with Samsung's 3nm reportedly losing several significant orders
Global semiconductor market to rebound with 13% growth in 2024, says WSTS
Samsung expands into automotive chip market with an aim to surpass Micron by 2025
Chinese-built Loongson 3A6000 CPU gains support from Asustek
Samsung ramps up 2.5D packaging capacity, eyeing Nvidia AI GPU orders
Huawei's NearLink wireless technology signals a decoupled connected world
Intel cuts off manufacturing in IDM2.0, TSMC is expected to benefit
Tesla's humanoid robot 'Optimus' debuts in Taiwan, showcasing AI advancements
ASML reportedly sees first big EUV equipment order cut from TSMC
US, Japanese, and Dutch semiconductor equipment export values to China dropped; more substantial strategies demanded by expert
Global top-5 notebook brands experience over 20% on-month shipment drop in October, says DIGITIMES Research
Global notebook shipments rise in 3Q23 but to slip in 4Q23, says DIGITIMES Research
Research Insight: order backlog, China demand to drive Infineon automotive segment in FY24
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