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NEWS TAGGED LOW-POWER
Wednesday 1 December 2021
Samsung intros new logic solutions to power next-gen automobiles
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Tuesday 23 November 2021
MediaTek validates Micron LPDDR5X for flagship 5G smartphone SoC
MediaTek has validated Micron Technology's low-power double data rate 5X (LPDDR5X) DRAM for MediaTek's new Dimensity 9000 flagship chipset for 5G smartphones, according to Micron.
Friday 20 August 2021
Intel unveils new chip architectures; expands partnership with TSMC
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
Wednesday 11 August 2021
Samsung intros 5nm processor for wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Tuesday 16 March 2021
Globalfoundries, Bosch team up for next-gen automotive radar technology
Globalfoundries has announced it is partnering with Bosch to develop and manufacture next-generation automotive radar technology, according to the companies.
Thursday 25 February 2021
Micron launches low-power memory qualified for automotive safety applications
Micron Technology has begun sampling its automotive low-power DDR5 DRAM (LPDDR5) memory that is hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL)...
Tuesday 1 December 2020
Imagination sells Ensigma Wi-Fi technology to Nordic Semiconductor
Imagination Technologies has announced the sale of its Ensigma Wi-Fi development operations and Wi-Fi IP tech assets to Nordic Semiconductor, which specializes in low-power wireless...
Wednesday 18 November 2020
Wafer capacity by feature size shows strongest growth at sub-10nm
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Wednesday 21 October 2020
Micron uMCP5 ready for mass production
Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.
Tuesday 20 October 2020
Dialog licenses non-volatile ReRAM technology to Globalfoundries for 22FDX platform
Dialog Semiconductor and Globalfoundries have entered into an agreement in which Dialog licenses its conductive bridging RAM (CBRAM) technology to Globalfoundries, according to the...
Friday 14 August 2020
Dialog announces compatibility of octal SPI NOR flash with Renesas MPU
Dialog Semiconductor has announced that its EcoXiP octal xSPI non-volatile memory (NVM), which was added to Dialog's portfolio through its recent acquisition of Adesto Technologies,...
Friday 10 July 2020
Imec, GF claim breakthrough in AI chip
Imec and Globalfoundries (GF) have jointly announced a hardware demonstration of a new artificial intelligence chip. Based on Imec's analog in memory computing (AiMC) architecture...
Monday 6 July 2020
ITRI transfers memory technologies to Taiwan chipmakers
Taiwan's Industrial Technology Research Institute (ITRI) has been engaged in the development of next-generation non-volatile memory technologies, such as ferroelectric RAM (FRAM)...
Wednesday 17 June 2020
GlobalWafers to expand 12-inch silicon wafer capacity in Taiwan
GlobalWafers has held a groundbreaking ceremony for the expansion of subsidiary Taisil Electronic Materials, and will use offshore capital to fund the expansion, which is set to complete...