At the Linley Fall Processor Conference, Intel revealed the first architectural details related to Tremont. Intel's newest and most advanced low-power x86 CPU architecture, Tremont offers a significant performance boost over prior generations. Tremont next-generation low-power x86 microarchitecture delivers significant IPC (instructions per cycle) gains gen-over-gen compared with Intel's prior low-power x86 architectures, said the chip vendor. Designed for enhanced processing power in compact, low-power packages, Tremont-based processors will enable a new generation of innovative form factors for client devices, creative applications for the Internet of Things (IoT), and efficient data center products, said Intel.

Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules for enterprise servers and data centers. The 128GB TSV DDR4 RDIMM is comprised of a total of 144 DDR4 chips, arranged into 36 4GB DRAM packages, each containing four 20nm-based 8Gb chips assembled with TSV packaging technology. Samsung's 128GB TSV DDR4 RDIMM provides a low-power solution for next-generation servers with speeds at up to 2,400Mbps, while cutting power usage by 50%, compared to using the previous highest capacity DRAM modules - 64GB LRDIMMs, whose four-chip package stacks are hampered by power and speed limitations caused by their use of conventional wire bonding. Samsung added the company will continue to introduce TSV DRAM with higher performance. These will include modules with data transfer speeds of up to 2,667Mbps and 3,200Mbps that help to meet intensifying enterprise server needs, while expanding TSV applications into high bandwidth memory (HBM) and consumer products.

SK Hynix has developed 6Gb low-power DDR3 (LPDDR3) using 20nm-class process technology. This product is a high-performance mobile memory solution that features low power consumption and high-density, ideal for premium mobile devices, according to the chipmaker. Four 6Gb LPDDR3 chips can be stacked up and realize a high density of maximum 3GB solution in a single package. In consequence, this package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to SK Hynix' 4Gb-based one. In addition, it works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand, according to the vendor. The SK Hynix 6Gb LPDDR3 works at 1866Mbps, and with a 32-bit I/O it processes up to 7.4GB of data per second in a single channel, and 14.8GB in a dual channel. It can be provided in a form of package-on-package (PoP) to mobile devices.