Cadence Design Systems has announced that its digital full flow has achieved certification for the Samsung Foundry 5nm low-power early (5LPE) process with extreme ultraviolet (EUV)...

NAND flash and low-power DDR chip suppliers continue to digest excess inventory which may indicate a disappointing second half of 2019 facing the memory sector, according to industry...

Microchip Technology via subsidiary Silicon Storage Technology (SST) has announced a strategic partnership with SK Hynix System IC to expand the availability of SuperFlash technology...

Micron Technology has announced that its monolithic 12Gb low-power double data rate 4X (LPDDR4X) DRAM has been validated for use in MediaTek's new Helio P90 smartphone platform reference...

Globalfoundries announced in August 2018 its decision to put 7nm FinFET R&D on hold indefinitely in a move to intensify the company's focus on delivering differentiated 14/12nm...

Arm has expanded its DesignStart program to include the Cortex-A5 CPU, Arm's low-power and Linux-capable application processor, according to the processor IP vendor. Developers can...

Innosilicon, which designs and develops cryptocurrency mining ASIC products, has announced its Terminator Sha256 Bitcoin mining ASIC series utilizes Samsung Foundry's advanced low-power...

MediaTek has completed validation (interoperability tests) of NarrowBand IoT connectivity (NB-IoT) with SoftBank to set the stage for future commercial NB-IoT applications within...

Austria-based sensor solutions supplier AMS has announced that its low-power IR VCSEL laser emitter, the PMSIL, is enabling the world's first implementation of user face recognition...

Driven by the colossal Internet of Things (IoT) opportunity, wireless technologies - including wireless local area network (WLAN), Bluetooth, cellular and low-power wireless - will...

Nanya Technology expects to start shipping 8Gb DDR4 memory for server applications in small volume in the fourth quarter of 2018, according to company president Lee Pei-ing.

Samsung Electronics has disclosed its comprehensive process technology roadmap updates down to 3nm at the annual Samsung Foundry Forum in the US.

Taiwan-based CPU IP provider Andes expects to see shipments of its silicon IP chips hit the 800 million mark in 2018, according to company president Frankwell JM Lin.

Macronix International has announced that STMicroelectronics is using Macronix International's 8-bit I/O serial NOR flash memory for ST's new STM32L4+ microcontroller discovery kits...

Samsung Electronics has announced the availability of its latest application processor (AP), the Exynos 7 Series 9610, built using the company's 10nm FinFET process.

The success and proliferation of integrated circuits has largely hinged on the ability of IC manufacturers to continue offering more performance and functionality for the money, according...

China-based pure-play foundry Semiconductor Manufacturing International (SMIC) is scheduled to enter volume production of chips fabricated using 28nm HKMG and HKMG+ processes in the...

After securing orders from STMicroelectronics, Globalfoundries' 22nm FD-SOI (22FDX) process is being evaluated by hundreds of potential customers looking to use a more advanced fully-depleted...

X-FAB today announced the availability of two new Non-Volatile Memory (NVM) IP solutions - a low power embedded Flash (eFlash) IP block and a NVRAM compiler. Both are based on the...

Processor IP provider Andes Technology has teamed up with Globalfoundries to provide low-power solutions for the foundry's 22nm FD-SOI process technology to jointly deepen their deployment...

Semiconductor Manufacturing International (SMIC) and Chengdu Analog Circuit Technology (ACTT) have jointly announced the availability of ACTT's analog IP solutions on SMIC's 55nm...

AMD has informed its partners that it plans to launch in February 2018 an upgrade version of its Ryzen series processors built using a 12nm low-power (12LP) process at Globalfoundries,...

Samsung Foundry will soon be ready to enter mass production of magnetoresistive random-access memory (MRAM) chips built using 28nm fully depleted silicon-on-insulator (FD-SOI) process...

Semiconductor Manufacturing International (SMIC) and QuickLogic have announced the availability of QuickLogic's ArcticPro embedded FPGA (eFPGA) technology on SMIC's 40nm low leakage...

Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...