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NEWS TAGGED LOW-POWER
Wednesday 1 December 2021
Samsung intros new logic solutions to power next-gen automobiles
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
Tuesday 23 November 2021
MediaTek validates Micron LPDDR5X for flagship 5G smartphone SoC
MediaTek has validated Micron Technology's low-power double data rate 5X (LPDDR5X) DRAM for MediaTek's new Dimensity 9000 flagship chipset for 5G smartphones, according to Micron.
Friday 20 August 2021
Intel unveils new chip architectures; expands partnership with TSMC
At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...
Wednesday 11 August 2021
Samsung intros 5nm processor for wearables
Samsung Electronics has announced its new wearable processor, the Exynos W920. The new processor integrates an LTE modem, and is built with an advanced 5nm extreme ultra-violet (EUV)...
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Tuesday 16 March 2021
Globalfoundries, Bosch team up for next-gen automotive radar technology
Globalfoundries has announced it is partnering with Bosch to develop and manufacture next-generation automotive radar technology, according to the companies.
Thursday 25 February 2021
Micron launches low-power memory qualified for automotive safety applications
Micron Technology has begun sampling its automotive low-power DDR5 DRAM (LPDDR5) memory that is hardware-evaluated to meet the most stringent Automotive Safety Integrity Level (ASIL)...
Tuesday 1 December 2020
Imagination sells Ensigma Wi-Fi technology to Nordic Semiconductor
Imagination Technologies has announced the sale of its Ensigma Wi-Fi development operations and Wi-Fi IP tech assets to Nordic Semiconductor, which specializes in low-power wireless...
Wednesday 18 November 2020
Wafer capacity by feature size shows strongest growth at sub-10nm
IC capacity for leading-edge (sub-10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, according...
Wednesday 21 October 2020
Micron uMCP5 ready for mass production
Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.
Tuesday 20 October 2020
Dialog licenses non-volatile ReRAM technology to Globalfoundries for 22FDX platform
Dialog Semiconductor and Globalfoundries have entered into an agreement in which Dialog licenses its conductive bridging RAM (CBRAM) technology to Globalfoundries, according to the...
Friday 14 August 2020
Dialog announces compatibility of octal SPI NOR flash with Renesas MPU
Dialog Semiconductor has announced that its EcoXiP octal xSPI non-volatile memory (NVM), which was added to Dialog's portfolio through its recent acquisition of Adesto Technologies,...
Friday 10 July 2020
Imec, GF claim breakthrough in AI chip
Imec and Globalfoundries (GF) have jointly announced a hardware demonstration of a new artificial intelligence chip. Based on Imec's analog in memory computing (AiMC) architecture...
Monday 6 July 2020
ITRI transfers memory technologies to Taiwan chipmakers
Taiwan's Industrial Technology Research Institute (ITRI) has been engaged in the development of next-generation non-volatile memory technologies, such as ferroelectric RAM (FRAM)...
Wednesday 17 June 2020
GlobalWafers to expand 12-inch silicon wafer capacity in Taiwan
GlobalWafers has held a groundbreaking ceremony for the expansion of subsidiary Taisil Electronic Materials, and will use offshore capital to fund the expansion, which is set to complete...
Thursday 21 November 2019
Intel unveils Tremont microarchitecture
At the Linley Fall Processor Conference, Intel revealed the first architectural details related to Tremont. Intel's newest and most advanced low-power x86 CPU architecture, Tremont offers a significant performance boost over prior generations. Tremont next-generation low-power x86 microarchitecture delivers significant IPC (instructions per cycle) gains gen-over-gen compared with Intel's prior low-power x86 architectures, said the chip vendor. Designed for enhanced processing power in compact, low-power packages, Tremont-based processors will enable a new generation of innovative form factors for client devices, creative applications for the Internet of Things (IoT), and efficient data center products, said Intel.
Wednesday 9 December 2015
Samsung 128GB TSV DDR4 RDIMM
Samsung Electronics has announced that it is mass producing what it calls the industry's first "through silicon via" (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules for enterprise servers and data centers. The 128GB TSV DDR4 RDIMM is comprised of a total of 144 DDR4 chips, arranged into 36 4GB DRAM packages, each containing four 20nm-based 8Gb chips assembled with TSV packaging technology. Samsung's 128GB TSV DDR4 RDIMM provides a low-power solution for next-generation servers with speeds at up to 2,400Mbps, while cutting power usage by 50%, compared to using the previous highest capacity DRAM modules - 64GB LRDIMMs, whose four-chip package stacks are hampered by power and speed limitations caused by their use of conventional wire bonding. Samsung added the company will continue to introduce TSV DRAM with higher performance. These will include modules with data transfer speeds of up to 2,667Mbps and 3,200Mbps that help to meet intensifying enterprise server needs, while expanding TSV applications into high bandwidth memory (HBM) and consumer products.
Friday 1 November 2013
SK Hynix 6Gb LPDDR3
SK Hynix has developed 6Gb low-power DDR3 (LPDDR3) using 20nm-class process technology. This product is a high-performance mobile memory solution that features low power consumption and high-density, ideal for premium mobile devices, according to the chipmaker. Four 6Gb LPDDR3 chips can be stacked up and realize a high density of maximum 3GB solution in a single package. In consequence, this package reduces the operating power as well as the standby current by 30% and the height of the package becomes thin compared to SK Hynix' 4Gb-based one. In addition, it works at ultra low-voltage of 1.2V thus it satisfies low power consumption which mobile applications demand, according to the vendor. The SK Hynix 6Gb LPDDR3 works at 1866Mbps, and with a 32-bit I/O it processes up to 7.4GB of data per second in a single channel, and 14.8GB in a dual channel. It can be provided in a form of package-on-package (PoP) to mobile devices.
Dec 3, 10:53
Enter the next phase of networking at a steady pace
Friday 3 December 2021
Impact of e-commerce, smart manufacturing on fashion industry
Friday 19 November 2021
Digitalizing textile supply chain
Friday 19 November 2021
Textile industry goes digital
TSMC enters pilot production of 3nm chips
OLED DDI supply may fall short of demand in 2022
Taiwan firms gearing up for upcoming Nvidia 5nm gaming GPUs
TSMC outsources part of CoWoS packaging production to OSATs
Samsung eyes reduced dependence on Qualcomm chips
US-Taiwan Economic Prosperity Partner Dialogue to connect Taiwan companies with US telecoms
Taiwan top-3 foundries poised to see combined revenues increase 25% in 2021
Digitimes Research worldwide notebook shipment update – October 2021
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