TSMC is expected to reiterate its sales growth outlook for 2022 of 25-29% while maintaining its capex target this year of US$40-44 billion at its upcoming investor conference call...
Having hired R&D talent from Huawei's HiSilicon, China's leading OSAT Jiangsu Changjiang Electronics Technology (JCET) has been developing its flip-chip(FC) packaging, 2.5D IC,...
Nvidia has announced its next-generation accelerated computing platform with Hopper architecture, dubbed H100 GPU, which is built using TSMC's 4nm (N4) process customized for the...
Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D...
MediaTek has seen its inventory level for handset application processors (including 4G and 5G ones) swell to 160-180 days from past regular levels of around 100 days, due mainly to...
Apple reportedly is in talks with a Korean substrate maker for the supply of ABF-based FC-BGA substrates for processing Apple Car chip solutions, sparking concerns about which IC...
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Nan Ya PCB has set aside a capex budget of NT$17 billion (US$605.5 million) for 2022, double last year's level of NT$8.45 billion, mainly to expand its production capacity for ABF...
It remains to be seen how Intel will materialize its IDM 2.0 growth vision, but the chipmaker will have to face a trade-off between production cost and chip performance in determining...
TSMC has secured significant orders demanding its sub-7nm process manufacturing from major US vendors, according to sources at semiconductor equipment suppliers.
Demand for silicon photonics, mainly used in high-bandwidth optical transceivers, continues to gain momentum to support proliferating high-performance computing (HPC) applications...
Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...
MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs,...
