中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    China's Big Fund Phase III makes first investment
    4h 59min ago
    The impact of China's anti-dumping probe of TI likely limited, expert says
    4h 59min ago
    Samsung foundry expands client base with Tesla deal and targets 4nm market
    4h 59min ago
    What is really at stakes from China's anti-dumping probe on US analog ICs?
    4h 59min ago
    Memory prices surged in 4Q25 defying seasonal trends amid AI-driven demand
    4h 59min ago
    NXP CEO transition in 2025 focuses on SDV, smart glasses, and robotics
    4h 59min ago
    NEWS TAGGED HBM4
    Tuesday 22 July 2025
    Inside Samsung's 1c DRAM breakthrough: How a design feud nearly derailed the project
    Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
    Monday 21 July 2025
    Samsung reportedly cracks 1c DRAM yield hurdle, positions HBM4 for AI rebound
    Samsung Electronics is preparing a major push to reclaim ground in the high-bandwidth memory (HBM) market, where it has lagged behind SK Hynix and Micron. Its sixth-generation 1c...
    Monday 21 July 2025
    Amazon, Google drive HBM memory boom as custom AI chips threaten Nvidia’s lead
    As demand for artificial intelligence (AI) accelerates, tech giants like Amazon, Google, and Meta are emerging as major players in the high-bandwidth memory (HBM) market. These companies...
    Friday 18 July 2025
    SK Hynix may lose HBM crown by 2026 as rivals trigger price showdown
    Goldman Sachs recently released a striking report on the high-bandwidth memory (HBM) market, stating that regardless of forecasting scenarios, SK Hynix's monopoly over HBM will eventually...
    Wednesday 16 July 2025
    Hanmi Semiconductor says hybrid bonders too costly for HBM4, HBM5 production
    Hanmi Semiconductor's chairman dismissed hybrid bonder equipment as impractical and too expensive for next-generation high-bandwidth memory production, as the South Korean company...
    Monday 14 July 2025
    Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

    As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

    Wednesday 9 July 2025
    Hanmi's HBM4 tools go live, but is 2029 too late for hybrid bonding?
    Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
    Friday 4 July 2025
    Intel's new AI accelerator may adopt HBM4? SK Hynix stresses no confirmed details
    Intel recently held its AI Summit in South Korea, sharing the latest trends in artificial intelligence (AI) technology and innovative applications across various industries. The event...
    Thursday 3 July 2025
    Samsung completes development of 1c DRAM, paving way for HBM4 rollout

    Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product...

    Thursday 3 July 2025
    Micron tightens grip on AI memory market as Samsung certification lags
    Micron Technology is stepping up its game in the competitive high-bandwidth memory (HBM) market, leveraging recent wins to boost production and capture rising demand driven by artificial...
    Wednesday 2 July 2025
    Towa expands South Korea presence as AI spurs demand for HBM packaging tools
    Japanese semiconductor equipment maker Towa Corporation, a global leader in advanced packaging systems, recently unveiled its newest technology for sixth-generation HBM4, aiming squarely...
    Wednesday 2 July 2025
    Samsung pitches 12-stack HBM3E to Nvidia after AMD's AI accelerator win
    Samsung Electronics is intensifying its push to secure a major HBM3E supply deal with Nvidia, as Device Solutions chief Jun Young-hyun visited Nvidia's Silicon Valley headquarters...
    Friday 27 June 2025
    SK Hynix debuts 16-layer HBM4, set to power AI chips in 2026
    At HPE Discover 2025, SK Hynix unveiled its 16-layer sixth-generation high bandwidth memory (HBM4) for the first time, aiming to maintain its technological leadership in the HBM4...
    Thursday 26 June 2025
    Micron ships HBM4 samples to customers, anticipates DDR4 shortage after EOL notice
    Micron is doubling down on HBM as a core growth driver, reporting strong momentum in its HBM3E ramp and laying out a clear roadmap for its next-generation HBM4 products.
    Monday 23 June 2025
    SK Hynix reportedly clinches custom AI memory orders from Nvidia, Microsoft, Broadcom
    SK Hynix has reportedly secured customized high-bandwidth memory (HBM) orders from Nvidia, Microsoft, and Broadcom, pulling ahead of domestic rival Samsung Electronics in the race...
    3/9 pages
    Research Report Database
    BIZ FOCUS
    Sep 9, 12:48
    Meet ADLINK's cExpress-R8: The compact solution to demanding and diverse industrial workloads
    Friday 12 September 2025
    SK hynix Completes World's First HBM4 Development and Readies Mass Production
    Friday 12 September 2025
    OneXPlayer Launched X1 Air 3-in-1 PC, Powered by BIWIN Mini SSD for Next-Gen Edge AI Storage
    Friday 12 September 2025
    WiseLink Announces $10M Bitcoin Allocation as Part of Treasury Strategy in Asia
    Summary of Tech Supply Chain News!