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NEWS TAGGED HBM4
Wednesday 2 April 2025
GUC announces tape-out of the world's first HBM4 IP on TSMC N3P
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...
Friday 28 March 2025
SK Hynix to finalize 2026 HBM production target by mid-2025 amid rising AI demand
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
Monday 24 March 2025
SK Hynix to pull M15X fab timeline forward by two months
SK Hynix is reportedly accelerating equipment installation at its M15X fab in Cheongju, South Korea, moving the original timeline forward from December to October in response to surging...
Friday 21 March 2025
Micron HBM revenue tops billion dollars amid expansion plans
Micron's HBM revenue exceeded US$1 billion this quarter. The company expects multibillion-dollar HBM revenue by 2025 and plans to start HBM4 production in 2026 while expanding capacity...
Thursday 20 March 2025
Samsung vows to reclaim ground in AI memory market with rollout
Samsung Electronics Co. pledged to strengthen its position in the high-bandwidth memory (HBM) chip market this year, in response to shareholder criticism over its underperformance...
Thursday 20 March 2025
SK Hynix, Micron exhibit AI memory solutions at Nvidia GTC
At the ongoing Nvidia GTC 2025, both SK Hynix and Micron Technology have demonstrated their respective AI memory solutions.
Wednesday 19 March 2025
SK Hynix launches early 12-layer HBM4 samples, eyes H2 production
SK Hynix announced on March 19 that it has begun delivering early samples of its new 12-layer HBM4 ultra-high performance DRAM for AI applications to key clients.
Wednesday 19 March 2025
SK Hynix ships world's first 12-layer HBM4 samples to customers
SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time...
Friday 14 March 2025
Global top-3 memory maker status, 4Q24

Introduction

Thursday 13 March 2025
Nvidia reportedly visits Samsung packaging plant amid HBM3E supply uncertainty
High bandwidth memory (HBM) major client Nvidia is said to have visited Samsung Electronics' advanced packaging plant again, just over a month after their last visit. Industry sources...
Friday 7 March 2025
Micron's Mark Liu hire aims to close HBM gap amid US chip push
Micron has appointed former TSMC chairman Mark Liu as a board member. Multiple South Korean media outlets report this move as Micron's attempt to expand its market share in high bandwidth...
Monday 3 March 2025
Micron outpaces Samsung in DRAM race among HBM competition
Micron Technology has delivered its sixth-generation 10nm DRAM samples ahead of schedule, pressuring Samsung Electronics as it struggles with yield issues and design adjustments....
Thursday 27 February 2025
SK Hynix reportedly hits 70% yield in HBM4 testing
SK Hynix has reportedly reached a significant milestone in its pre-production trials by raising the yield rate of its sixth-generation high-bandwidth memory (HBM4) to 70%. This achievement...
Friday 24 January 2025
SK Hynix confident in HBM4, prepares for 1c DRAM mass production
SK Hynix is poised to achieve a record-high operating profit in 2024, potentially surpassing Samsung Electronics (Samsung) for the first time. The company maintains its optimistic...
Thursday 23 January 2025
SK Hynix reportedly to begin 1c DRAM production first, disrupting Samsung's HBM strategy
As Samsung Electronics (Samsung) attempts to reshape the global memory market through its sixth-generation high bandwidth memory (HBM4), industry watchers are closely monitoring two...