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    NEWS TAGGED HBM4
    Friday 20 March 2026
    Samsung reportedly secures OpenAI HBM4 supply deal, shifts foundry capacity
    Samsung Electronics is reportedly set to exclusively supply sixth-generation high-bandwidth memory (HBM4) to OpenAI while reallocating more than half of its advanced foundry capacity...
    Friday 20 March 2026
    Samsung signals AI memory shift with HBM showcase at 2026 shareholders meeting
    Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM),...
    Thursday 19 March 2026
    AMD, Samsung deepen AI chip ties with HBM4 supply and foundry talks

    AMD CEO Lisa Su met Samsung Chairman Lee Jae-yong on March 18, the same day the two companies signed a memorandum of understanding (MOU)...

    Thursday 19 March 2026
    Samsung, AMD expand AI memory and compute partnership with MOU to align HBM4 supply and DDR5 support
    Samsung Electronics announced it signed a Memorandum of Understanding with AMD to expand its strategic collaboration on next-generation AI memory and computing technologies.
    Thursday 19 March 2026
    SK Hynix presses ahead on HBM4 despite tightening AI memory supply
    SK Hynix is accelerating its next-generation memory strategy, with stable progress on HBM4 production, aggressive capacity expansion in South Korea, and a growing focus on AI-driven...
    Wednesday 18 March 2026
    AMD's Lisa Su courts Korea: Samsung HBM4 sealed, Naver next
    AMD CEO Lisa Su broadened the company's collaboration with Samsung Electronics on next-generation artificial intelligence (AI) memory and met with regional partners, including Naver,...
    Tuesday 17 March 2026
    HBM4 showdown at GTC 2026: SK Hynix, Samsung, and Micron battle for AI memory supremacy
    The 2026 NVIDIA Global Technology Conference (GTC) has transcended its origins as a developer forum to become the ultimate proving ground for the high-bandwidth memory (HBM) indust...
    Tuesday 17 March 2026
    Micron enters high-volume production of HBM4 and PCIe Gen6 SSDs for Nvidia platforms
    At the Nvidia GTC 2026 conference, Micron Technology signaled a major push in the AI hardware race, announcing high-volume production of memory and storage components purpose-built...
    Tuesday 17 March 2026
    Nvidia GTC 2026: Samsung unveils HBM4E, showcasing comprehensive AI solutions, Nvidia partnership, and vision
    Samsung Electronics outlined the full range of AI computing technologies it will present at Nvidia GTC 2026 in San Jose, California, March 16-19, highlighting memory, logic, foundry,...
    Tuesday 17 March 2026
    SK hynix to Showcase AI Memory Leadership at NVIDIA GTC 2026

    SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. 

    Monday 16 March 2026
    DRAM prices surge 180% as HBM competition shifts to profitability
    DRAM and NAND flash prices have soared by as much as 180% since the Lunar New Year, amid worsening memory chip supply shortages that are expected to persist at least until late 2027...
    Friday 13 March 2026
    Samsung targets 2nm process for HBM4E base die to boost AI chip edge
    Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...
    Wednesday 11 March 2026
    Nvidia audits Samsung HBM4 packaging for Rubin GPUs, report says
    Nvidia has reportedly conducted a series of closely spaced visits to Samsung Electronics' semiconductor packaging campus in Cheonan, South Korea, signaling that verification of the...
    Monday 9 March 2026
    Industry mulls thicker HBM standards for 20-layer stacks
    Global semiconductor companies are discussing relaxing thickness standards for next-generation high-bandwidth memory (HBM) as the industry moves toward higher stack counts in future...
    Monday 9 March 2026
    Nvidia halts China-bound H200 production, shifts TSMC capacity to Vera Rubin

    Nvidia has halted production of artificial intelligence (AI) chips intended for the Chinese market and redirected manufacturing capacity...

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    BIZ FOCUS
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    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook