Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

Samsung Electronics and SK Hynix are reportedly allocating additional or flexible DRAM production capacity to server DDR5 and other...

SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as...

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...