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NEWS TAGGED GUC
Wednesday 10 January 2024
GUC taped out UCIe 32G IP using TSMC 3nm and CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 32Gbps per lane,...
Wednesday 6 September 2023
GUC announces 5nm HBM3 PHY and controller silicon proven at 8.4Gbps

Global Unichip Corp. (GUC), the advanced ASIC leader, announced that they have silicon proved 8.4 Gbps HBM3 solution on...

Thursday 6 April 2023
GUC tapes out 3nm 8.6Gbps HBM3 and 5Tbps/mm GLink-2.5D IP using TSMC advanced packaging technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking...
Thursday 27 October 2022
GUC unveils GLink 2.3LL, powerful D2D interconnect IP using 2.5D technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced that GLink 2.3LL (GUC's die-to-die Link) interface IP for TSMC CoWoS and InFO chiplets integration platforms passed...
Thursday 7 July 2022
GUC demonstrates world's first HBM3 PHY, controller, and CoWoS platform at 7.2Gbps
Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix's first available HBM3 samples. The platform...
Thursday 10 March 2022
GUC announces 2.5D and 3D multi-die APT platform for AI, HPC, networking ASICs
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces the availability of a platform to shorten design cycles for low-risk, high-yield production of ASICs with TSMC 2.5D...
Tuesday 31 August 2021
GUC announces ultra-high bandwidth and power efficient die-to-die (GLink 2.0) total solution
Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed that its second-generation GLink 2.0 (GUC multi-die interLink) interface, using TSMC 5nm process and TSMC advanced...
Tuesday 8 June 2021
GUC tapes out AI/HPC/networking platform on TSMC CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D...
Monday 24 May 2021
GUC announces GLink-3D die-on-die interface IP using TSMC N5 and N6 process for 3DFabric advanced packaging technology
Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI,...
Tuesday 17 November 2020
GUC D2D total solution opening the new era of flagship SoC
Global Unichip Corp. (GUC), the advanced ASIC leader, disclosed today that it has successfully demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC...
Tuesday 11 July 2017
Global Unichip opens new Korea office
Taiwan-based Global Unichip, a fabless ASIC design house, has announced the establishment of its new office in Seoul. The move is to enhance both technical and business customer su...
Monday 1 December 2014
Global Unichip obtains server chip orders from major Japan-based networking solution provider
Global Unichip has announced that an ongoing series of server-related designs for one of the major Japan-based networking solution providers is in mass production.
Monday 30 August 2010
Synopsys DesignWare SATA IP enables first-pass silicon success for Global Unichip
Synopsys has announced that Global Unichip Corporation (GUC) has achieved first-pass silicon success for its GP5080 SSD SoC utilizing the Synopsys DesignWare SATA IP solution, consisting...
Thursday 7 August 2008
Weak 3Q market forecast for Ene, Elan, Pixart and GUC
Because of a conservative outlook among their customers, Taiwan IC design houses Ene Technology and Elan Microelectronics both announced seasonal and on-year sales declines in July...