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Will Taiwan, South Korea, and Janpan join semiconductor alliance with US?
NEWS TAGGED FULL HD
Wednesday 6 October 2021
AIOTO GO: Advanced AI-powered remote surveillance system
AIOTO Tech has announced the launch of the AIOTO GO, a wireless AI security camera with 4G LTE capabilities and a 2-month standby battery life designed to protect outdoor spaces....
Wednesday 11 November 2020
MediaTek announces new Chromebook chips
MediaTek has unveiled its MT8192 and MT8195 chipsets for the next generation of Chromebooks, with the 7nm MT8192 for mainstream devices and the 6nm MT8195 for premium models.
Friday 17 July 2020
Driver ICs for notebooks, TVs in stable demand through 2H20
Taiwan's suppliers of driver ICs, midrange logic ICs and memory packaging materials for notebooks, TVs and other electronics devices supporting stay-at-home economic activities are...
Wednesday 8 January 2020
AMD announces new CPUs and GPUs at CES 2020
AMD at CES 2020 announced an x86 8-core ultrathin notebook processors as part of the AMD Ryzen 4000 series mobile processor family, built on the groundbreaking Zen 2 core architecture...
Tuesday 13 November 2018
Taiwan notebooks – 3Q 2018
Taiwan's notebook shipments grew 4.3% sequentially but decreased 4.7% on year in the third quarter of 2018, as Intel's CPU shortages affected vendors' overall order placements.
Friday 1 June 2018
Arm intros new Cortex-A76 CPU suite
Arm has introduced its Cortex-A76 CPU, a new microarchitecture enabling 35% more performance and 40% less power, and the ARM Mali-G76 GPU and Mali-V76 VPU to deliver "laptop-class...
Thursday 29 June 2017
Qualcomm expanding mobile chip offering for mid-range smartphones
Qualcomm has introduced its Snapdragon 450-series mobile chips, a new entry to the Snapdragon 400 mobile platform tier designed for mid-range smartphones and tablets. The Snapdragon...
Friday 15 January 2016
Taiwan market: Samsung launches 18.4-inch tablet
Samsung Electronics has unveiled Galaxy View, a 18.4-inch tablet featuring in-house-developed Exynos 7580 1.6GHz 8-core processor, Full HD resolution, 2GB memory and 32GB storage,...
Monday 28 December 2015
With AMOLED on the rise, Full HD screens proliferate further in 3Q15, says IHS
Full HD panels reached a record 21% of the smartphone display market in the third quarter of 2015, due in large part to increases in AMOLED panel adoption by Samsung Electronics and...
Tuesday 1 December 2015
Smartphone panel suppliers to increase LTPS capacity and turn further to Full HD market in 2016, says WitsView
Since 2013, major LCD panel makers have continually invested in fabs producing LTPS LCD panels to capture demand in the high-end smartphone market. According to WitsView, global LTPS...
Friday 14 August 2015
China market: 5.5-inch Full HD to be widely used in CNY1,000 smartphones in 2016
While 5-inch HD (720 by 1280) is currently the mainstream touch panel standard for China-made smartphones priced at the CNY1,000 (US$158) level in the China market, China-based vendors...
Friday 24 July 2015
5.5-inch Full HD panel modules drop to US$17 for July, down from US$24 in 1Q15, says firm
5.5-inch Full HD panel modules have dropped to US$17 in July, down from US$24 at the beginning of 2015, according to research firm Sigmaintell Consulting.
Wednesday 1 July 2015
China market: HD leads over Full HD in May smartphone sales, says firm
In May 2015, 32.6% of smartphone sales in China were for HD units while 21.4% were for Full HD, according to a new report from Sigmaintell Consulting.
Monday 22 June 2015
Microsoft looking to charge extra licensing fees for high-end notebooks
Microsoft has been talking to notebook brand vendors about the licensing of Windows 10 recently and is planning to charge extra fees for notebook models with high-end hardware such...
Monday 8 June 2015
5-inch and FHD displays gaining market share in 2015, says firm
The development of the smartphone market has plateaued after many years of high growth, and the on-year shipment growth for 2015 is expected to slow down. According to WitsView, smartphones...
Tuesday 14 January 2020
Acer Spin 3 convertible notebook
Acer has debuted the new Spin 3 convertible notebook line that features slimmer designs, the latest 10th Gen Intel Core processors and Windows 10 Home. Featuring a 14-inch Full HD display, the new Spin 3 has a traditional 16:9 aspect ratio and 7.82mm bezels that provide a 78% screen-to-body ratio. The device weighs 1.5kg and has a thickness of 16.9mm.
Monday 4 June 2018
Continuing with the classic design of the previous generation, the new Nokia 5.1 gets its structural integrity from a single block of 6000 series aluminium, refined through a rigorous 33 stage process of machining, anodising and polishing to give a satin finish. The new Nokia 5.1 packs a 0.3-inch bigger display in a 2mm narrower body compared to the previous version. Nokia 5.1 comes with a higher resolution 5.5-inch Full HD+ display in 18:9 aspect ratio. Powered by a 2.0 GHz MediaTek Helio P18 octa-core processor, Nokia 5.1 delivers a performance that is 40% faster and more powerful than the previous generation, according to the vendor. It is equipped with an upgraded 16MP rear camera with phase detection auto-focus and wide-angle front camera. Nokia 5.1's fingerprint sensor has been relocated to the back of the phone so the user can unlock it with the index finger or pay with NFC through Google Pay. The new Nokia 5.1 will come in three colors: copper, tempered blue and black; two storage/RAM options: 2GB/16Gb, 3GB/32GB. It will be available starting July 2018 at a global average retail price of EUR189.
Wednesday 31 August 2016
Samsung 14nm Exynos chips
Samsung Electronics has begun mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14nm process technology for the budget smartphone market as well as other IoT devices. Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices. Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70 improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS. Additionally, with design optimization and feature consolidation for components such as PMICs and RF functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones, according to Samsung. It supports screen resolution up to WXGA, record and playback of videos in Full HD, and improved ISP (image signal processor) for 8Mp/13Mp front and back cameras.
May 18, 11:03
Advanced vision AI eliminates potential risks in cleanroom environments for semiconductor and panel manufacturers
Wednesday 11 May 2022
NeoGene unveils novel ultra-thin heat-pipe-array vapor chamber technology for ultra-high-density power battery pack application
Monday 9 May 2022
HOLTEK launches new 32-bit touch key MCUs – Provides professional technology services and solutions
Tuesday 3 May 2022
Chenbro wins 2022 iF Design Award for high-density storage server chassis
Notebook production in China unlikely to be fully restored until July
IC design houses under pressure to drop prices
Vedanta looking for chip customers in advance
Brand notebook vendors cut orders for 2022
YMTC sampling 192-layer 3D NAND chips
Apple car team reportedly in talks with Korean and Japanese suppliers
AMD, MediaTek reportedly in talks to form JV
TSMC to raise quotes for advanced, mature process technologies by 10-20%
BYD Semiconductor takes major stake in Energen
Is GF a good buy for Intel?
EV penetration to rise to 30% in 2025, says DIGITIMES Research
Non-foundry IC segments gaining weight in HPC era, says DIGITIMES Research
DIGITIMES Research worldwide notebook shipment update – February 2022
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