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Monday 31 January 2011
Unimicron to spend NT$6-7 billion for capacity ramp in 2011
Unimicron Technology will invest NT$6-7 billion (US$207-241 million) to ramp up its capacity for HDI boards and flip-chip chip-scale packaging (FC CSP) substrates in 2011 to meet...
Tuesday 28 September 2010
Kinsus to commence operation of China plant
Taiwan-based IC substrate maker Kinsus Interconnect Technology revealed that construction of a new plant in Suzhou, China is near completion, and production will kick off in the fourth...
Wednesday 28 July 2010
Kinsus looks to strong demand for FC CSP and base station substrates in 3Q10
IC substrate maker Kinsus Interconnect Technology expects its revenues to grow 5-10% sequentially in the third quarter with flip-chip chip-scale packaging (FC CSP) and base station...
Tuesday 9 March 2010
IC substrate maker Kinsus sees order visibility through May
Kinsus Interconnect Technology has seen its order visibility extend to May 2010, with new orders focusing on bismaleimide triazine (BT)-based flip-chip chip scale packaging (FC CSP)...
Friday 29 January 2010
Kinsus share price tumbles as Qualcomm lowers revenue forecast for fiscal 2010
Shares of Taiwan-based IC substrate maker Kinsus Interconnect Technology fell the 7% daily limit to close at NT$80 (US$2.49) on the Taiwan Stock Exchange (TSE) on January 28 after...
Monday 7 December 2009
Kinsus November revenues drop more than 10%
IC substrate supplier Kinsus Interconnect Technology saw November revenues drop over 10% to NT$1.07 billion (US$33.37 million), as customers slowed down their orders amid inventory...
Friday 27 November 2009
Kinsus revenues to drop slightly in November and December; stay flat in 4Q09
IC substrate maker Kinsus Interconnect Technology's revenues are estimated to drop 5% sequentially in November and December 2009 due to inventory adjustment at downstream customers,...
Monday 26 October 2009
NPC expects strong revenues from FC CSP substrates in 2010
Nan Ya Printed Circuit Board (NPC) may see its revenues from flip-chip chip scale packaging (FC CSP) substrates double in 2010 because of significant demand from the handset segment,...
Thursday 10 September 2009
Kinsus to see revenues grow 15-20% sequentially in 3Q09
Taiwan-based IC substrate maker Kinsus Interconnect Technology is expected to see its revenues grow 15-20% sequentially in the third quarter, higher than the 15% increase projected...
Tuesday 18 August 2009
Kinsus FC CSP substrate utilization rate up on orders from Qualcomm
Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...
Wednesday 17 June 2009
IC substrate maker Kinsus says high-margin products to sustain growth for 2H09
Kinsus Interconnect Technology is expected to manage sequential revenue growth from July through December 2009, driven by growing sales of its high-margin product lines, according...
Wednesday 22 April 2009
IC substrate makers Kinsus and PPT see mixed 1Q09 results
IC substrate maker Kinsus Interconnect Technology may post better than expected results for the first quarter of this year, as peer maker Phoenix Precision Technology (PPT) saw losses...
Thursday 9 April 2009
Kinsus sees revenues jump 45% sequentially in March
Kinsus Interconnect Technology has reported that revenues soared 45% sequentially to NT$754 million (US$22.44 million) in March, buoyed by increasing shipments of flip-chip (FC) chip-scale...
Friday 20 March 2009
Kinsus expects strong substrate shipment growth in March due to China 3G deployment
IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of...
Friday 20 February 2009
Kinsus BT-based FC and FC CSP substrate shipments to increase in 2009
Kinsus Interconnect Technology has reported January sales of NT$433 million (US$12.45 million), down 21% on month. The company expects sales to increase to NT$500-550 million in February...