STATS ChipPAC has expanded the embedded wafer-level ball-grid array (eWLB) technology to reconstituted 300mm wafers, according to the company. By adding capacity through 300mm wafer...
China-based foundry Grace Semiconductor Manufacturing has launched an IP portfolio developed to assist customers in complementing their own IC design. The IP blocks offer various...
Global sales of built-in 3G modules are expected to grow by an annual rate of over 30% in the next three years with their sales volume to surpass those of plug-type 3G data cards...
eMemory Technology has announced its Neobit one-time-programmable (OTP) memory built using 0.11-micron high-voltage production process entered volume production at MagnaChip Semiconductor...
VIA Technologies has announced the VIA ART-3000, a fanless and rugged embedded box system based on the Em-ITX form factor motherboard, offering a solution for a variety of industrial...
Lanner Electronics has launched the LEC-7100, a fanless industrial computer powered by the new dual core Intel Atom D510 processor at 1.66GHz. The LEC-7100 is designed to be easily...
Semiconductor Manufacturing International Corporation (SMIC) has announced successful commercial production of a high-end contactless smart card chip designed by Shanghai Hua Hong...
AMD has introduced the ATI Radeon E4690 Mobile PCI Express module (MXM) for the graphics-intensive embedded systems at the Digitimes Tech Forum (DTF) 2010 in Taiwan.
VIA Technologies has announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of ultra-compact and portable embedded devices.
Applied Micro Circuits Corporation (AppliedMicro, formerly AMCC) and Taiwan Semiconductor Manufacturing Company (TSMC) have jointly announced a collaboration enabling AppliedMicro's...
AMD has announced immediate availability of a new enterprise-class embedded platform based on the quad-core AMD Opteron processor and new AMD SR5690/SP5100 server chipset.
SAN JOSE, Calif., September 14, 2009 - Cypress Semiconductor Corp. (NYSE: CY) today announced two new architectures in its PSoC programmable system-on-chip platform that dramatically...
Spansion's financial restructuring following its exit from Chapter 11 will involve a debt-for-equity swap, according to John Nation, director of corporate marketing for the NOR flash...
AMD has announced immediate availability of two new dual-core, 18W TDP processors for the scalable ASB1 BGA embedded client platform, the Turion Neo X2 processor Model L625 and the...
