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Monday 14 July 2025
As physical AI matures, SOS Lab bets big on smarter, smaller LiDAR
With autonomous vehicles and service robots ushering in a new era of "physical AI," the spotlight is once again on core sensing technologies. While Tesla CEO Elon Musk has famously...
Monday 14 July 2025
SoftBank to launch high-altitude 5G network using solar planes and airships by 2026
SoftBank is preparing to commercialize its next-generation telecommunications infrastructure using high-altitude platforms by 2026, marking a pivotal milestone in its UTX (Ubiquitous...
Monday 14 July 2025
Tariffs bite: China–US trade drops 9% in 1H as chip imports, rare earth exports climb

China–US trade fell 9.3% year-over-year in the first half of 2025, totaling CNY2.08 trillion (approx. US$290 billion), according...

Monday 14 July 2025
BOE pivots beyond displays to glass substrate packaging, perovskite solar
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology...
Monday 14 July 2025
Next-gen semiconductor push: SK Hynix prepares laser cutting overhaul for ultra-thin wafers

As the semiconductor industry pushes the boundaries of chip performance, manufacturing processes are being forced to adapt. In preparation...

Monday 14 July 2025
Huawei's 'Little HiSilicon' launches all-out chip blitz: from RISC-V MCUs to AI edge SoCs
HiSilicon (Shanghai) Technologies — Huawei's application-specific chip design arm known as "Little HiSilicon" — has launched a broad lineup of self-developed chips spanning...
Monday 14 July 2025
Unigroup's US$14 billion comeback: post-restructuring push spans chips, global reach, IPOs
On July 11, 2025, Tsinghua Unigroup marked three years since its strategic overhaul with a strong performance report highlighting its resurgence in China's high-tech sector. Over...
Monday 14 July 2025
Kioxia, YMTC jump ahead with wafer-bonded NAND in volume production
Kioxia and YMTC are pioneering the use of wafer bonding technologies— CMOS directly Bonded to Array (CBA) and Xtacking, respectively — for next-generation NAND flash memory...
Monday 14 July 2025
SK On partners with L&F to build North American LFP battery supply chain
SK On signed a memorandum of understanding (MOU) with South Korean battery cathode materials company L&F to promote its lithium iron phosphate (LFP) battery business targeting...
Monday 14 July 2025
Weekly news roundup: China’s semiconductor setback, MediaTek gains on Qualcomm, and ongoing US-China chip tensions

Below are the most-read DIGITIMES Asia stories from July 7 to July 13, 2025. This week's top three highlights include China’s semiconductor...

Monday 14 July 2025
South Korea advances self-driving commuter bus with risk prediction model
South Korea's autonomous driving technology has entered the proof-of-concept stage. Their PanTa-G self-driving bus operates in Pangyo and has so far served over 55,000 passengers...
Monday 14 July 2025
Huawei’s HiSilicon debuts low-power Cat.1 chip to boost IoT reach
On July 10, 2024, Huawei's chip subsidiary HiSilicon launched its first Cat.1 IoT communication chip — the Hi2131 — officially entering the fast-growing cellular IoT market,...
Monday 14 July 2025
Hyundai sets 2028 goal for AI-integrated software-defined vehicles

Hyundai Motor, South Korea's largest automaker, has announced plans to release its first production vehicle equipped with end-to-end...

Sunday 13 July 2025
China plots desert AI hub with 115,000 Nvidia chips, skirting US export bans
China plans to build at least 39 data centers in the desert regions of Xinjiang and Qinghai, outfitted with over 115,000 Nvidia H100 and H200 GPUs. These advanced chips have been...
Saturday 12 July 2025
Japan's OSAT firms unite to cut costs and reclaim industry ground
Japan's outsourced semiconductor assembly and test (OSAT) industry, long composed of small, regional firms with limited resources, is making a rare push for collective strength. In...