Renowned chip architect Jim Keller was invited to speak at the SEMICON Taiwan 2025 Master Forum. At the start of his speech, Keller announced that his company, Tenstorrent, will establish...
Merck has pointed out that the semiconductor industry's growth curve has reached a combined output value of EUR650 billion (US$760.4 billion) and is expected to surpass EUR1 trillion...
Apple is preparing to debut vapor chamber (VC) cooling in the upcoming iPhone 17 Pro, with Taiwan's Asia Vital Components (AVC) and China's Suzhou Tianmai Thermal Technology reportedly...
The Industrial Development Administration (IDA) of Taiwan's Ministry of Economic Affairs (MOEA) is partnering with 16 local companies to present heterogeneous integration packaging...
Ian Hathaway, managing partner of the OpenAI Startup Fund, recently visited Taiwan for the first time to discuss the next steps in artificial intelligence development at a public...
Meta has intensified investments in GPUs, expanded data centers, and aggressively recruited AI talent, aiming to bolster its AI initiatives. However, the company's AI development...
The global robotics sector continues to grow as Taiwanese transmission component manufacturer Chieftek Precision announces a strategic focus on robot development, moving beyond humanoid...
At the Taiwan AI Academy annual conference, Asus chairman Jonney Shih urged Taiwan to strengthen its AI development by integrating computing platforms, model capabilities, data governance,...
After securing orders from electric vehicle maker Tesla for autonomous driving AI chips, Samsung Electronics' foundry division is reportedly in talks with xAI, an artificial intelligence...
Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its...
Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented...
Foundries lead in FOPLP advanced packaging development due to their integrated processes, followed by testing firms that leverage existing wafer architectures. Panel fabs face precision...
Switzerland has unveiled Apertus, an open-source large language model created through collaboration between the Swiss Federal Institute of Technology in Lausanne (EPFL), the Swiss...
Tesla has announced plans to establish a new R&D center in Kopenick, Berlin, Germany. Positioned between Tesla's existing Gigafactory in Grunheide, Brandenburg, and central Berlin,...
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
