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    China's national holiday fails to boost consumer electronics demand
    Oct 9, 17:30
    Taiwanese suppliers seize Philippines' booming energy transition market
    Oct 9, 17:29
    Commentary: Largan and Genius Electronic Optica's bottlenecks in robot lens design
    Oct 9, 17:29
    Commentary: Would splitting semiconductor profits with US leave Taiwan left with scraps?
    Oct 9, 17:29
    China sees new smartphone launches spur by holiday season amid market recovery
    Oct 9, 17:29
    Russian protectionism drives divergent strategies for Chinese automakers
    Oct 9, 17:29
    NEWS TAGGED DEVELOPMENT
    Monday 15 September 2025
    Omnipotent combination of semiconductor and AI ushers in new phase of technological explosion, says former TSMC R&D VP
    Former TSMC R&D vice president Jack Sun, who currently serves as senior vice president at National Yang Ming Chiao Tung University (NYCU), emphasized that semiconductors can no...
    Monday 15 September 2025
    Foxconn advances strategic investments to lead AI smart glasses industry
    As the smartphone market nears saturation, smart glasses are emerging as the next frontier for AI-enabled wearable devices. Foxconn is positioning itself beyond contract assembly...
    Monday 15 September 2025
    Taiwan's Teco and Kenda explore digital twin applications

    Dassault Systèmes held its annual summit forum in Taiwan on September 11, 2025, highlighting digital twin adoption in local industries...

    Sunday 14 September 2025
    Beyond the data center: Nvidia’s GB10 and DGX Spark mark a new phase in its AI strategy
    At the recent Hot Chips 2025 conference, Nvidia detailed its latest GB10 system-on-chip (SoC) architecture, representing a miniaturized application of the Blackwell GPU architecture...
    Sunday 14 September 2025
    Beijing Tsinghua professor warns China must cut AI reliance on Nvidia

    Wei Shaojun, vice chairman of the China Semiconductor Industry Association and professor at Tsinghua University, has called on Asian...

    Saturday 13 September 2025
    Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth
    To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
    Saturday 13 September 2025
    TSMC builds new fab supply chain hub in southern Taiwan
    TSMC continues to advance its investment plan for the Pingtung Science Park, officially opening the site for vendors to begin construction. Arthur Chuang, vice president of Facility...
    Friday 12 September 2025
    South Korea targets massive hydrogen market, aiming to become global leader by 2030
    The South Korean government is accelerating the development of its hydrogen economy, focusing on three key policy directions: demand market expansion, supply planning, and infrastructure...
    Friday 12 September 2025
    SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
    At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
    Friday 12 September 2025
    Commentary: MicroLED is lighting up display industry, but can it open new doors?
    AUO recently announced a collaboration with leading satellite navigation and smart wearable brand Garmin to launch the world's first smartwatch featuring microLED display technology,...
    Friday 12 September 2025
    SEMICON Taiwan 2025: IBM's roadmap for semiconductor and quantum development extends through 2042
    At a SEMICON Taiwan forum on Quantum computing, IBM Japan CTO and Vice President Norishige Morimoto detailed how AI's growing complexity—estimated to have surged by more than...
    Friday 12 September 2025
    SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
    Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
    Friday 12 September 2025
    SK hynix Completes World's First HBM4 Development and Readies Mass Production
    Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...
    Friday 12 September 2025
    Nitto Denko and IBM collaborate on advanced semiconductor packaging materials
    Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
    Thursday 11 September 2025
    Wistron increases investment in the US, doubling capital expenditure for California subsidiary
    Wistron's board of directors approved a significant increase in the capital expenditure budget for its Fremont, California-based wholly-owned subsidiary WisLab EMS Corporation, doubling...
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    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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