Wednesday 23 March 2022
Tong Hsing expects promising demand for automotive CIS devices
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors (CIS) and other niche ICs, has expressed optimism that its strong shipments...
Tuesday 22 March 2022
NAND flash chipmakers step up controller chip purchases
NAND flash chip vendors including Samsung Electronics and Micron Technology have moved to increase more of their controller chip production to third-party suppliers, such as Phison...
Wednesday 16 March 2022
COVID spike in China disrupting handset CIS shipments, sources say
A spike in COVID-19 cases in Hong Kong and other Chinese cities is disrupting handset CMOS image sensor (CIS) shipments, as well as deliveries of related modules and other devices,...
Tuesday 8 March 2022
GF announces next-gen silicon photonics solutions
GlobalFoundries' next-generation silicon photonics platform, GF Fotonix, is available now to address the explosive growth of soaring data volumes while significantly reducing power...
Friday 25 February 2022
UMC to expand Singapore fab site for additional 22/28nm process capacity
United Microelectronics (UMC) has announced plans to set up a new advanced manufacturing facility adjacent to its Fab12i in Singapore. Dubbed Fab12i P3, the facility is designed for...
Friday 18 February 2022
Xintec cautious about 2022
CMOS image sensor backend specialist Xintec has expressed caution about its sales performance this year, citing the ongoing pandemic, labor shortages, and supply-side challenges,...
Wednesday 9 February 2022
Automotive CIS packaging capacity fully loaded
Automotive CMOS image sensor (CIS) packaging capacity at Taiwan-based OSATs such as Tong Hsing Electronic Industries and Xintec remains fully loaded, and they can easily carry out...
Tuesday 1 February 2022
New semiconductor fabs in Japan to go online in 2022-2024
With the Japan government stepping up their support for the local IC manufacturing sector, several new wafer fabs, including a joint venture (JV) between TSMC and Sony, will be constructed...
Friday 14 January 2022
VCM demand for smartphones to stay flat in 2022
VCM (voice coil motor), used to drive camera lens modules, is expected to see demand for smartphone applications stay flat in 2022, with the prospect that suppliers will focus more...
Thursday 6 January 2022
Specialty DRAM prices soon to stop falling
DDR3 and other specialty DRAM prices are expected to stop falling and begin to rise as early as between the end of the first quarter and the second quarter, according to industry...
Monday 29 November 2021
New IC fab projects to draw government subsidies in Japan
TSMC, Kioxia and Micron Technology are reportedly expected to receive government subsidies in Japan to support their new fabs or expansion projects locally in Japan.
Monday 15 November 2021
IntelliEPI sees GaN HEMT as new growth driver in 2022
Taiwan's epi-wafer supplier Intelligent Epitaxy Technology (IntelliEPI) has started taking orders for its high-performance GaN-based HEMT products, which are expected to serve as...
Tuesday 9 November 2021
Qualcomm growing presence in PA segment to benefit Taiwan III-V partners
As Qualcomm is actively expanding its presence in the GaAs-based handset PA segment, its partners in Taiwan including foundries Win Semiconductors and Advanced Wireless Semiconductor...
Thursday 28 October 2021
New SMIC fab in Shenzhen to produce DDI, PMIC
China's Semiconductor Manufacturing International (SMIC) has unveiled more details about its new 12-inch fab project In Shenzhen, such as the fab's initial focus on the manufacture...
Wednesday 27 October 2021
PTI readies measures against SK Hynix-Intel NAND buyout deal
Memory and logic IC backend house Powertech Technology (PTI) expects its revenue performance to stay on the growth track in the fourth quarter of 2021 after posting record sales results...