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    NEWS TAGGED CMOS
    Thursday 13 August 2026
    TSMC-Sony image sensor venture pushes Japan chip investment to JPY6 trillion

    TSMC said on August 11 that it will invest in CMOS image sensor development and mass production with Sony Group in Kumamoto Prefecture,...

    Monday 10 August 2026
    Samsung unveils 200MP image sensor as Oppo targets first adoption

    Samsung Electronics has launched its next-generation 200-megapixel CMOS image sensor, the ISOCELL HPC, and reports said Oppo is set...

    Thursday 6 August 2026
    NEO Semiconductor unveils AI memory platform aimed at easing global bottlenecks
    NEO Semiconductor has launched NEO.AI, a memory platform it says could help address one of the biggest constraints on artificial intelligence (AI) systems worldwide: limited memory...
    Wednesday 5 August 2026
    Kioxia and Sandisk unveil faster, denser QLC flash memory for AI infrastructure
    Kioxia and Sandisk have introduced a next-generation QLC 3D flash memory technology that boosts storage density, bandwidth, and power efficiency, a development that could help global...
    Friday 31 July 2026
    Kioxia begins sampling 1TB 3D flash memory for AI devices
    Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage...
    Tuesday 16 June 2026
    TSMC eyes A16 mass production in 4Q26 and Intel refines 18A roadmap with 18A-P
    Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing...
    Friday 29 May 2026
    SmartSens, Unisoc team up on Micro LED optical interconnects for AI computing
    Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop...
    Wednesday 27 May 2026
    China-based SmartSens, Unisoc team up on Micro LED optical interconnects for AI clusters
    SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for...
    Wednesday 15 April 2026
    Tong Hsing Electronic expects revenue acceleration as fiber optics drives expansion
    Tong Hsing Electronic, a Taiwanese semiconductor packaging and substrate manufacturer specializing in CMOS image sensors, said on Monday that optical communication modules have become...
    Friday 20 March 2026
    HiSilicon unveils self-developed CIS chip, shaking global sensor supply chain
    The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first...
    Monday 16 March 2026
    Sony CIS yield issue raises Apple supply risks, opens door for Samsung

    Sony's core semiconductor business, CMOS image sensors (CIS), has reportedly encountered yield challenges in recent production. Industry...

    Wednesday 4 March 2026
    SmartSens raises CIS prices 10-20% for Samsung, Nexchip output on memory cost pressure

    China-based CMOS image sensor (CIS) supplier SmartSens Technology has notified customers of price increases, stating that from March 1,...

    Monday 3 November 2025
    Tong Hsing Electronics eyes growth engines to revive 2026 operations
    Tong Hsing Electronic, a CMOS image sensor (CIS) packaging and semiconductor assembly company, reported NT$2.85 billion (US$93 million) in consolidated revenue for the third quarter...
    Friday 19 September 2025
    Imec CEO calls CMOS 2.0 the anchor for AI’s future

    Dr. Luc Van den hove, president and CEO of Belgian research institute imec, used his keynote at SEMICON Taiwan 2025 to call for a global...

    Thursday 14 August 2025
    Samsung wins Apple iPhone image sensor deal in Texas, eyes Qualcomm next
    Samsung Electronics plans to begin producing its in-house–designed high-performance CMOS image sensors (CIS) at its Austin, Texas, wafer fab in 2027 for Apple's iPhones. Industry...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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