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Wednesday 27 November 2024
Mitsubishi Electric invests in new power semiconductor back-end factory
Mitsubishi Electric is ramping up its power semiconductor production in Japan to meet the surging demand fueled by the EV revolution and global climate change initiatives.
Wednesday 27 November 2024
TSMC's CoWoS far from secure: Etron CEO flags Intel EMIB's rising threat
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
Wednesday 27 November 2024
Samsung executive reshuffle: new foundry head to boost Nvidia ties
Samsung Electronics (Samsung) has implemented a significant personnel adjustment within its Device Solutions (DS) division to regain competitiveness in the semiconductor sector. This...
Wednesday 27 November 2024
Samsung's challenges mount: Nvidia Jensen Huang urge HBM3E swift approval
Nvidia is currently conducting high bandwidth memory (HBM) verification tests with Samsung Electronics (Samsung), with industry attention focused on the validation timeline and potential...
Wednesday 27 November 2024
Supermicro returns to the battlefield with B300 as the focal point
Having emerged from its financial report turmoil, Supermicro is back in action, intensifying competition in the AI server market. Industry sources indicate that while other ODM manufacturers...
Wednesday 27 November 2024
Samsung hires new foundry CTO amidst leadership changes
Samsung Electronics has enacted changes to its management, including the appointment of a new chief technology officer (CTO) for its foundry operations.
Wednesday 27 November 2024
Power IC maker Potens extensively engages with automotive industry
Potens Semiconductor, known for its power semiconductors, is actively entering the automotive sector despite the current inventory adjustments in the industry.
Wednesday 27 November 2024
IC design houses see clients stockpile Wi-Fi 7 chips in preparation for new products in 2025
Wi-Fi 7 shipments have accelerated significantly in the second half of 2024, and industry experts expect Wi-Fi 7 penetration rates to grow in 2025, with upgrades to consumer devices,...
Wednesday 27 November 2024
US sanctions threaten to snuff out China's nascent HBM development
While the US has not yet imposed sanctions on China's high-bandwidth memory (HBM) chips and manufacturing equipment, industry sources expect such restrictions are inevitable. This...
Wednesday 27 November 2024
Tech waltz with China: Apple, Nvidia courted as Intel doubles down
A series of meetings between Chinese officials and US tech executives signals potential warming ties, with senior representatives from Nvidia and Apple holding discussions in Beijing...
Wednesday 27 November 2024
Speculation arises about AMD developing AI mobile chip; insiders remain doubtful
Recent market speculation suggests that AMD has developed an AI processor (APU/NPU) suitable for mobile devices. With its exclusive GPU technology, it is expected to compete in the...
Wednesday 27 November 2024
Huawei stays in smartphone market despite chip disadvantage
The US trade ban has prevented Huawei from competing with other smartphone vendors in 5G mobile chip performance, but the Chinese tech giant is still staying in the smartphone sector,...
Wednesday 27 November 2024
US ban expansion may stifle China's AI chip ambitions
Market speculation suggests that the US may impose stricter restrictions on China. On November 28, it is anticipated that 200 Chinese semiconductor companies will be added to a trade...
Wednesday 27 November 2024
40nm crisis: how TSMC shaped Nvidia's triumph, AMD's demise
The 2009 TSMC 40nm process crisis was a defining moment for the wafer foundry industry, offering pivotal lessons for the broader semiconductor sector. As TSMC founder Morris Chang...
Wednesday 27 November 2024
Samsung, SK Hynix trim DRAM output while Chinese rivals expand
SK Hynix and Samsung Electronics are focusing on upgrading equipment, transitioning processes, and expanding high-bandwidth memory (HBM) packaging capacity instead of investing in...