SK Hynix has reportedly begun mass production of its 321-layer 1Tb TLC 3D NAND Flash products, posing a potential threat to Samsung Electronics' (Samsung) leading position. This development...
Taiwan-based pure-play foundry PSMC is building a 12-inch wafer fab for Tata Electronics in India, and Lam Research, eyeing growing Indian opportunities, plans to set up an office...
US President-elect Donald Trump's latest announcement of a 10% tariff on Chinese imports has created waves in international markets. While the relationship between this new tariff...
When the Wireless Power Consortium (WPC) announced the Qi2 wireless charging standard in 2023, attention was on its integration progress into smartphones. Supply chain members, however,...
Following a previous donation of two sets of 12-inch wafer equipment to Taiwan's National Science and Technology Council (NSTC), TSMC has donated an additional three sets to the Ministry...
Topco Technologies, which distributes silicone and other chemical materials, is optimistic about demand for AI servers, but the outlook for the automotive sector is bleak.
International integrated device manufacturers (IDMs) have begun offering automotive-grade chips specifically designed for the China market in 2024, responding to mounting cost pressures...
Although the US and Dutch governments have banned ASML from selling extreme ultraviolet (EUV) and advanced deep ultraviolet (DUV) lithography equipment to China, sales and after-sales...
Power management and motor control chip standards are evolving in response to increasingly complex end application demands, and microcontroller units (MCU) are being used to handle...
Advanced material provider Wah Hong is developing packaging and materials for Micro LED and Mini LED technologies with prices ranging from US$200 to US$300 per square meter. Company...
In 2024, major Chinese semiconductor businesses continue to announce closures or severe layoffs, according to industry sources. Xiangdixian Computing Technology, commonly referred...
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Since unveiling Apple Silicon in 2020, Apple has redefined Mac chip technology through three transformative shifts. While the company initially planned a two-year transition from...
Onsemi's leadership has been increasing its presence in China recently. After Felicity Carson, SVP of global operations at Onsemi, attended PCIM Asia 2024 in Shenzhen at the end of...
Due to restrictions on accessing Nvidia's most advanced GPUs, China's top 500 supercomputing systems rely exclusively on earlier-generation Nvidia accelerators, according to data...
