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Tuesday 9 December 2025
Baidu evaluates Kunlun chip spin-off for Hong Kong IPO, but offers no guarantee
Baidu has responded to reports that its in-house chip business, Kunlunxin, is planning a separate listing on the Hong Kong Stock Exchange by stating it is currently evaluating the...
Tuesday 9 December 2025
Moore Threads CEO leverages Nvidia legacy to challenge GPU giant
In a global GPU market dominated by US-based Nvidia, Chinese startup Moore Threads is rapidly emerging as a formidable local challenger. The driving force behind this bold counterattack...
Tuesday 9 December 2025
Samsung moves to narrow gap with TSMC as silicon photonics race heats up
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with...
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips...
Monday 8 December 2025
Research Insight: Strong momentum expected for data center AI chip packaging in 2025-2030
According to the latest report published by DIGITIMES Asia, global data center AI chip shipments are projected to grow from 30.5 million units in...
Monday 8 December 2025
SK Hynix restructures global operations amid reported HBM4 production delay
SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic...
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Monday 8 December 2025
Samsung reportedly gains momentum in foundry and memory with improved 4nm yields
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company...
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Monday 8 December 2025
SK Hynix reportedly delays HBM4 mass production amid Nvidia Rubin AI accelerator launch plans
SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...
Monday 8 December 2025
TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion...

Monday 8 December 2025
China expected to surpass Taiwan as second-largest IC design revenue generator by 2026, IDC forecasts
According to IDC's latest forecast, released on December 5, 2025, China is expected to overtake Taiwan, accounting for the world's second-largest integrated circuit (IC) design revenue...
Monday 8 December 2025
Weekly news roundup:Intel hires TSMC veteran, Samsung reportedly wins TPU HBM4 order
These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.
Monday 8 December 2025
Samsung shifts focus from HBM to DDR5 modules for higher profits
Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition, reallocating capacity toward DDR5 RDIMM modules and freeing up around 80,000...
Monday 8 December 2025
Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...