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Wednesday 19 February 2025
Young Optics shifts focus to CPO amid declining micro-projection, 3D printing revenue
Young Optics' consolidated revenue declined by 14.6% year over year in 2024 to NT$2.572 billion (US$78.7 million), largely due to competition from Chinese mid-range single-panel LCD...
Wednesday 19 February 2025
China's HBM breakthrough intensifies pressure on Samsung
China's memory industry is making remarkable progress, substantially closing the technology gap with South Korea in DRAM and NAND flash manufacturing. The country has also achieved...
Wednesday 19 February 2025
Nuvoton readies Microsoft co-developed BMC chip for mass production in 2025
Nuvoton, a microcontroller (MCU) provider, is emerging stronger from inventory corrections. Driven by recent pre-shipment demand from notebook/PC clients and continued adjustments...
Wednesday 19 February 2025
Exclusive: Kaynes SemiCon expands global presence, nears OSAT customers in Japan and US
Kaynes SemiCon is strengthening its position in the outsourced semiconductor assembly and test (OSAT) market, moving closer to securing new customers from Japan and the US as part...
Wednesday 19 February 2025
Packaging firm Xintec cautious about 1H25 prospects
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
Wednesday 19 February 2025
ASICs struggle to challenge Nvidia's GPU dominance
The increasing adoption of application-specific integrated circuits (ASICs) for artificial intelligence (AI) has sparked discussions about potential competition to Nvidia's GPU market...
Wednesday 19 February 2025
Apple's self-made wireless chips push suppliers to adapt
Apple is ramping up efforts to develop its own wireless connectivity chips, signaling a shift away from suppliers. The company is advancing in modem, Wi-Fi, and RF chip development,...
Wednesday 19 February 2025
Nikon aims to reclaim market share with ASML-compatible ArF immersion lithography system
Nikon plans to introduce a new ArF immersion lithography system platform in fiscal year 2028 (April 2028 - March 2029) that offers compatibility with ASML equipment, marking a strategic...
Wednesday 19 February 2025
ASE and PTI step up FOPLP investments to tap AI boom
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
Wednesday 19 February 2025
Global silicon wafer shipments and revenue start to recover in late 2024
In the latter half of 2024, global demand for silicon wafers began to rebound from the industry's downturn experienced in 2023, as reported by the SEMI Silicon Manufacturers Group...
Wednesday 19 February 2025
China's subsidy boosts flat-screen TV sales, while chipmakers face mixed demand
China recently unveiled a series of subsidy policies targeting consumer electronics and home appliances to stimulate domestic consumption. Beyond the central government's efforts,...
Wednesday 19 February 2025
Hua Hong moves to advanced nodes following intensified legacy node competition
Amid intensifying competition in the mature-node segment, Hua Hong Semiconductor is pivoting toward higher-value process technologies. The company posted a fourth quarter of 2024...
Wednesday 19 February 2025
Arm shows signs of transformation into chip development; cloud ASIC becomes primary battlefield
Recent market rumors suggest that Arm is entering the chip development battleground, with Meta's cloud computing chip as its first product. Many are concerned that this indicates...
Wednesday 19 February 2025
TSMC takes over Intel foundry? Samsung and Rapidus face steep headwinds
The global market is watching how TSMC, pressured by the US, might assist Intel's foundry operations, while Samsung Electronics and Rapidus, also facing challenges, may similarly...
Wednesday 19 February 2025
SK Hynix expands HBM3E production, boosting Hanmi Semiconductor's growth despite DeepSeek threat
SK Hynix is reportedly expanding its production of fifth-generation, 12-layer HBM3E, with Hanmi Semiconductor and ASMPT expected to lead in equipment orders. Hanmi is set for growth...