CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Friday 31 October 2025
What India's latest PCB drive means for its semiconductor supply chain growth
India's newly approved multilayer and high-density interconnect (HDI) printed circuit board (PCB) projects mark a crucial upstream shift in the country's electronics manufacturing...
Thursday 30 October 2025
Trump concludes Asia tour with rare earth and tech deals
US President Donald Trump has ended his six-day trip to Asia.
Thursday 30 October 2025
UMC reports Q3 gains as specialty and 22nm platforms boost growth

Benefiting from increased wafer shipments and higher capacity utilization, United Microelectronics Corporation (UMC) reported its most...

Thursday 30 October 2025
Taiwan approves funding for local IC design houses to advance AI and chip innovation
As Taiwan seeks to strengthen its position in the global semiconductor race, the government is shifting its focus toward homegrown innovation. Taiwan's Ministry of Economic Affairs...
Thursday 30 October 2025
MXIC chair vows comeback after ninth straight quarterly loss
Memory chipmaker MXIC reported a net loss of NT$862 million (US$28.1 million) in the third quarter of 2025, marking its ninth consecutive quarterly deficit. Chairman Miin Wu candidly...
Thursday 30 October 2025
AMEC reports 46% sales jump on strong etching, thin-film tool momentum
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) reported strong growth in the first three quarters of 2025, driven by surging demand for its etching...
Thursday 30 October 2025
Samsung 3Q25 marks the reset of the global memory hierarchy
Samsung Electronics staged a strong rebound in the third quarter of 2025 and set the tone for the next phase of the memory cycle, where AI infrastructure, premium product mix, and...
Thursday 30 October 2025
Singapore leverages advanced packaging to capture share of US$1 trillion chip market
Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference...
Thursday 30 October 2025
STATS ChipPAC targets 600mm panel-level packaging in roadmap for next-generation AI chips

Dr. Nokibul Islam, Senior Director at STATS ChipPAC, presented the company's advanced packaging technology roadmap at the 2025 Advanced...

Thursday 30 October 2025
'Semiconductor paradox' defines next chip boom, says director of Singapore's SSIA

Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging...

Thursday 30 October 2025
Analysis: Japan's new PM aims to replicate TSMC playbook with tech investment push
Japan's new Prime Minister Sanae Takaichi announced a growth strategy prioritizing "crisis management investment" in AI, semiconductors, and quantum technology to address economic...
Thursday 30 October 2025
Hanwha Semitech and Hanmi Semiconductor escalate HBM equipment patent dispute
Korean media have confirmed that Hanwha Semitech, previously sued by Hanmi Semiconductor for patent infringement, has now filed a counter-lawsuit against Hanmi, accusing Hanmi's HBM...
Thursday 30 October 2025
Wingtech urges the Netherlands to reverse takeover of Nexperia through Dutch public media

Chinese electronics manufacturer Wingtech Technology has filed a formal statement with the Dutch public broadcaster NOS, urging the Netherlands...

Thursday 30 October 2025
STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
Thursday 30 October 2025
GlobalFoundries to invest EUR1.1 billion to expand Dresden semiconductor facility
GlobalFoundries announced plans to invest EUR1.1 billion to expand its semiconductor manufacturing operations at its Dresden, Germany site. The investment, part of the project known...