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    NEWS TAGGED CHIPS + COMPONENTS
    Saturday 3 January 2026
    Micron and GlobalFoundries strengthen Singapore's position in advanced AI chip manufacturing
    Singapore is drawing a new wave of semiconductor investment as global chipmakers expand advanced manufacturing tied to artificial intelligence infrastructure, reinforcing the city-state's...
    Saturday 3 January 2026
    Analysis: Japan targets advanced packaging to crack TSMC's manufacturing edge
    Japanese semiconductor firms are pivoting toward advanced packaging and alternative lithography as TSMC extends its scale advantage in artificial intelligence chips. TSMC's 3nm and...
    Saturday 3 January 2026
    Chang Wah accelerates Asia expansion as chip packaging booms
    Chang Wah Electromaterials and its affiliate Chang Wah Technology are expanding operations across Taiwan, China, and Malaysia as global chipmakers and packaging houses ramp up capacity...
    Saturday 3 January 2026
    Analysis: Chip boom squeezes device makers as surging component costs threaten margins
    The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...
    Friday 2 January 2026
    Memory shortages to persist through 2026 as AI server demand surges

    Global memory markets are expected to remain tight through 2026 as aggressive spending by cloud service providers (CSPs) on AI infrastructure...

    Friday 2 January 2026
    Asus to pause new smartphone launches in 2026, maintain mobile operations
    Smartphone distributors in Taiwan have recently said they are no longer able to obtain Asus handsets through local agents and claimed they had received information indicating that...
    Friday 2 January 2026
    IC substrates and networking PCBs grow; materials and equipment face shortages
    The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
    Friday 2 January 2026
    Baidu's AI chip unit Kunlunxin confidentially files for Hong Kong IPO
    Baidu is moving forward with plans to spin off its AI chip unit, Kunlunxin, and list it in Hong Kong, highlighting the company's push for semiconductor self-sufficiency. On January...
    Friday 2 January 2026
    CXMT logs first annual profit on DRAM price rebound

    ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in global...

    Friday 2 January 2026
    Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
    Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
    Friday 2 January 2026
    Vietnam urges Intel to boost semiconductor backend capacity
    The Vietnamese government is urging Intel to further grow its semiconductor packaging and testing capabilities in the country, seeking to strengthen the nation's role in the global...
    Friday 2 January 2026
    US approval of TSMC equipment exports to China reflects strategy shift
    Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved...
    Friday 2 January 2026
    China's CXMT moves toward IPO with global DRAM share nearing 4%
    China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass...
    Friday 2 January 2026
    Samsung reportedly seals land deal, paving way for Yongin semiconductor complex
    Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving...
    Friday 2 January 2026
    Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition
    Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds that are approximately 30% faster than current mass-produced offerings. Industry observers...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook