Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according...

Memory module maker Transcend Information reported consolidated revenue of NT$5.07 billion (approx. US$138.66 million) for June 2026...

Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity...

Amid ever-shifting geopolitical concerns and a US$50 billion injection from the CHIPS and Science Act to revitalize domestic semiconductor...

Global markets are likely to feel the effects of a renewed rise in memory prices, as tighter supply and early inventory buying lift...

The global high-bandwidth memory market is expected to pivot from HBM3E to HBM4 in the second half of 2026, setting up a sharper contest...