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Wednesday 8 July 2026
National Center for Instrumentation Research helps academia break 2D materials bottleneck
As AI infrastructure chip orders flood in and TSMC runs near nonstop, academia has found it difficult to carry out industry-academia collaboration with the world's top foundry house...
Wednesday 8 July 2026
Samsung widens Nvidia Vera Rubin memory play with PCIe 6.0 eSSD

Samsung Electronics has started mass production of its PM1763 enterprise SSD, a PCIe 6.0-based drive built for AI infrastructure and slated...

Wednesday 8 July 2026
CPUs return to AI spotlight as agentic workloads reshape data center demand; Perplexity plans to adopt Nvidia's Vera
As AI workloads pivot toward emerging needs for systems that can perform tasks with a coordinated balance between speed and control, the hardware race is moving beyond GPUs. While...
Wednesday 8 July 2026
Samsung's HBM4 comeback hinges on one chip-level advantage

Samsung Electronics is using HBM4 to test whether its memory, logic, foundry, and advanced packaging businesses can finally work as...

Wednesday 8 July 2026
Apple tests CXMT DRAM, thrusting China's memory champion into AI spotlight

China's CXMT has moved from a little-known state-backed DRAM maker to one of the most closely watched companies in the global memory...

Wednesday 8 July 2026
AI servers squeeze MOSFET supply while PC slump tests power component pricing power

AI servers are tightening Taiwan's power component supply chain, lifting demand for MOSFETs, PMICs, cooling motors and power management...

Wednesday 8 July 2026
China unveils memristor chip for real-time neural dynamics, pushes computing into millisecond range

A Chinese research team has developed a phase-change memristor-based neural dynamical system chip, offering a potential hardware path...

Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Wednesday 8 July 2026
Chinese equipment maker wins first large-format PLP lithography order for AI packaging equipment
Circuit Fabology Microelectronics Equipment (CFMEE) has secured China's first commercial order for a large-format panel-level packaging lithography tool, marking the company's entry...
Wednesday 8 July 2026
Msscorps posts record 2Q revenue on AI and chip testing demand

Msscorps reported record consolidated revenue in June, and for the first half of 2026, as demand from AI and semiconductor customers...

Wednesday 8 July 2026
ThinTech Materials Technology eyes FOPLP gains, BNCT growth through 2028

ThinTech Materials Technology (TTMC) is currently the only supplier with technology transfer recognition approved for FOPLP metal substrates...

Wednesday 8 July 2026
Enterprise SSD shortage lifts DDR4 8Gb 3Q26 contract prices

Memory prices are rising faster than expected as global AI demand strains DRAM and flash supply, with knock-on effects for PCs, data...

Wednesday 8 July 2026
ADATA revenue tops 2025 full-year total as memory supercycle gains pace
ADATA Technology posted another record month in June 2026, pushing its first-half 2026 consolidated revenue to NT$64.27 billion(US$2.0 billion) and surpassing its full-year 2025 total...
Wednesday 8 July 2026
PGC 2Q26 revenue hits record as advanced-node orders stay strong
IC design service provider Progate Group Corporation (PGC) reported preliminary revenue of NT$159 million (approx. US$5.0 million) for June 2026, down 12.3% from May but up 88.4% from...
Wednesday 8 July 2026
As Synopsys exits legacy manufacturing software, chipmakers may move toward in-house factory tools
Synopsys is preparing to discontinue a suite of manufacturing process control software used by semiconductor manufacturers, marking a strategic shift that reflects changing priorities...