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    NEWS TAGGED CHIPS + COMPONENTS
    Monday 6 July 2026
    NXP chief says robots need autonomous computing to move beyond remote control

    As physical AI and robotics spread globally, NXP CEO Rafael Sotomayor said robots will only reach commercial scale if they can think...

    Monday 6 July 2026
    Phison says AI demand could erase NAND memory's boom-and-bust cycle
    AI is reshaping the memory market in ways that could matter well beyond Taiwan and China, according to Phison Electronics founder and chief executive Pua Khein-Seng. He said growing...
    Monday 6 July 2026
    Exclusive Interview: Dutch startup Nearfield targets AI chip process control expansion after US$380 million funding round
    Dutch semiconductor equipment startup Nearfield Instruments has completed a US$380 million Series D funding round, the largest-ever fundraising for a Dutch deep-tech company. The company...
    Monday 6 July 2026
    Huawei chip chief proposes Tau Law V2 centered on time-based scaling
    Huawei's semiconductor chief is promoting a post-Moore roadmap that shifts industry focus from shrinking transistors to reducing time across the computing stack, a framework backed...
    Monday 6 July 2026
    Micron breaks ground on Hiroshima expansion to boost AI memory chip production
    Micron Technology has begun construction on an expansion of its existing semiconductor plant in Higashi-Hiroshima, western Japan, as part of a JPY1.5 trillion (approx. US$9.3 billion)...
    Monday 6 July 2026
    Meta's AI cloud idea underscores a search for returns, not an AI retreat
    Meta is reportedly exploring a new AI cloud infrastructure business that would let enterprises use its AI models and some unused GPU capacity, a move that could lift hardware utilization...
    Monday 6 July 2026
    India launches third semiconductor plant as CG Semi begins commercial production in Gujarat
    India Prime Minister Narendra Modi inaugurated CG Semi's Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat, marking the start of commercial production at...
    Monday 6 July 2026
    China TPU chipmaker Zhonghao Xinying launches Xuyu AI processor to challenge GPU-based computing

    Zhonghao Xinying (Hangzhou) Technology has launched its new self-developed high-performance TPU AI processor, Xuyu, alongside Taize...

    Monday 6 July 2026
    Analysis: AI supercycle could drive semiconductor market beyond US$2 trillion by 2030
    The global semiconductor market is entering a historically significant growth phase. According to WSTS's latest June forecast, global semiconductor revenue is projected to grow by...
    Monday 6 July 2026
    Asahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging
    Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further...
    Monday 6 July 2026
    Samsung Electro-Mechanics, Sumitomo Chemical to form glass-core venture for chip substrates

    Samsung Electro-Mechanics signed a final agreement on July 2 with Sumitomo Chemical's Korean subsidiary Dongwoo Fine-Chem to form a...

    Monday 6 July 2026
    India roundup: India accelerates semiconductor ambitions through policy and global partnerships
    India accelerated its semiconductor ambitions through deeper Japan cooperation, policy advances, new manufacturing partnerships, and local technology investments, reinforcing efforts...
    Monday 6 July 2026
    Analysis: Taiwan's semiconductor sector enters 2026 helium crunch, with nearly 90% dependent on Qatar
    Taiwan's chipmakers walked into the 2026 helium supply shock more exposed to Qatar than any other major buyer, sourcing nearly 88% of their rare-gas imports from the Gulf state in...
    Monday 6 July 2026
    ESMT revenue hits record high as DDR2 and DDR3 prices keep climbing
    Elite Semiconductor Microelectronics Technology (ESMT), a memory IC design house, posted record monthly consolidated revenue of NT$4.85 billion (approx. US$152 million) in June 2026,...
    Sunday 5 July 2026
    Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
    Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM,...
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