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Monday 11 May 2026
AMD's 2nm defection to Samsung dents TSMC's AI grip
The AI semiconductor supply chain is showing unexpected signs of a shift, with TSMC's long-held dominance in the foundry market beginning to loosen. US chipmakers are increasingly...
Monday 11 May 2026
DIGITIMES Insight: MediaTek denies Intel link as TSMC's packaging lead faces new test

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet...

Monday 11 May 2026
Phison targets AI storage and edge computing growth through Phison 3.0 strategy
Phison Electronics Corp. reported record revenue and profit for the first quarter of 2026, while Chief Executive Khein-Seng Pua warned that a severe imbalance in the global NAND market...
Monday 11 May 2026
Tesla AI5 ignites Samsung-LG race for ABF substrates, robot parts

LG Innotek is seeking to enter Tesla's AI semiconductor supply chain by targeting ABF-based FC-BGA substrate orders for the automaker's...

Monday 11 May 2026
AI inference boom fuels memory race, with Samsung in pursuit
AI-driven demand and new product cycles are accelerating competition among major memory makers, creating pressure across storage and component supply chains. Production is running...
Monday 11 May 2026
Chinese semiconductor suppliers expand SEA presence at SEMICON SEA 2026
At SEMICON Southeast Asia 2026 in Kuala Lumpur, China's semiconductor equipment makers are steadily "infiltrating" the Southeast Asian market, extending from back-end packaging and...
Monday 11 May 2026
ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029
Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler...
Monday 11 May 2026
AI boom drives Taiwan's semiconductor testing industry into record expansion

To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test...

Monday 11 May 2026
Weekly news roundup: Taiwan freezes trading in MediaTek; 2D NAND shortage spirals
Below are the most-read DIGITIMES Asia stories from the week of May 4-10, 2026:
Monday 11 May 2026
AI surge drives Taiwan push for second-source PCB materials as market booms
The global copper-clad laminate market expanded sharply as AI computing demand forced higher-spec hardware, and Taiwan's printed circuit board supply chain moved to secure second-source...
Monday 11 May 2026
The AI memory squeeze may not ease before 2028
Global memory supply is under severe strain, prompting major cloud service providers to sign multi-year contracts with memory makers and forcing the industry to rethink capacity spending...
Monday 11 May 2026
Taiwan chip testing firm sheds power unit, pivots to AI validation as margins recover
Taiwan-based electronics verification and analysis specialist Integrated Service Technology (iST) posted weaker first-quarter revenue and an operating loss amid a major operational...
Monday 11 May 2026
Nvidia backs IREN in 5GW AI infrastructure push tied to US$2.1 billion stake
Nvidia is expanding its influence beyond AI chips and deeper into the infrastructure layer underpinning the global artificial intelligence boom, announcing a strategic partnership...
Monday 11 May 2026
Samsung eyes Exynos 2700 as test for chip-unit recovery
Samsung Electronics is looking to the tentatively named Exynos 2700 application processor (AP) as a key test for its non-memory semiconductor recovery, with the chip's adoption rate...
Monday 11 May 2026
India roundup: India accelerates semiconductor and display ambitions with new approvals, AI infrastructure expansion

India is advancing its electronics and semiconductor manufacturing strategy through new approvals...