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Thursday 18 June 2026
Imec, Sony unveil backside interconnect method for 3D chip stacking

Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and...

Thursday 18 June 2026
Tim Cook says Apple price hikes are unavoidable as AI squeezes memory supply

In an exclusive interview with The Wall Street Journal, Apple CEO Tim Cook made an unusually blunt admission. The company is...

Thursday 18 June 2026
Japan lasers in on India's Assam state for chip and infrastructure corridor

Japanese Prime Minister Sanae Takaichi is scheduled to visit Assam in northeastern India in early July 2026. According to Nikkei,...

Thursday 18 June 2026
AI chip boom strains probe card supply, Taiwan test interface maker weighs prepayment deals
MPI Corporation, a major probe card supplier, said AI demand is tightening supply across the probe card market and extending order visibility, with the company considering a prepayment...
Thursday 18 June 2026
Exclusive: Winbond NOR flash reportedly enters Nvidia supply chain
Winbond's NOR flash has reportedly entered Nvidia's supply chain for the first time, as AI server demand drives a surge in memory consumption and Nvidia's next-generation Vera Rubin...
Thursday 18 June 2026
Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants,...

Thursday 18 June 2026
Taiwan chip makers signal durable upcycle as memory prices and AI demand align

Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising...

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label — but hurdles remain

The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of...

Thursday 18 June 2026
Nichicon raises e-cap prices as supply tightens, costs increase
Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's...
Thursday 18 June 2026
SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

Thursday 18 June 2026
Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...
Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Thursday 18 June 2026
TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on s...