CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Thursday 8 January 2026
CES 2026: Arm moves into robotics with new dedicated unit
Arm Holdings has restructured its operations to create a Physical AI business unit. The move expands its footprint in robotics, as automation systems dominated this year's Consumer...
Thursday 8 January 2026
Win Semiconductors sees 29.37% revenue boost in 4Q25, driven by US smartphone shipments
Win Semiconductors, the world's leading gallium arsenide (GaAs) wafer foundry, reported consolidated revenue of NT$1.61 billion (US$51.31 million) for December 2025, down slightly...
Thursday 8 January 2026
Why TSMC is giving mature fabs billion-dollar makeovers
TSMC is undertaking significant upgrades at its existing 8-inch and 12-inch fabrication facilities that process chips at 90nm and above, while accelerating expansion for cutting-edge...
Thursday 8 January 2026
KLA opens R&D and Innovation Hub in Chennai to boost India semiconductor ecosystem
US-based semiconductor process control and process-enabling technology leader KLA Corporation has inaugurated a new INR3 billion (approx. US$36 million) R&D and Innovation Hub...
Thursday 8 January 2026
China reportedly tells firms to pause Nvidia H200 orders to push domestic AI chips
Chinese authorities have reportedly asked domestic tech companies to halt orders for Nvidia's H200 AI chips, according to Reuters, signaling tighter oversight even as US export...
Thursday 8 January 2026
CES 2026: Snapdragon X2 Plus strengthens Qualcomm's AI PC push as power efficiency becomes a key battleground
Qualcomm Inc. introduced its Snapdragon X2 Plus platform at CES 2026, the newest addition to the Snapdragon X series aimed at professionals, emerging creators, and regular users. The...
Thursday 8 January 2026
Samsung Electronics posts sharp profit rebound in fourth quarter on AI-driven memory demand
Samsung Electronics reported a strong rebound in profitability in the fourth quarter of 2025, supported by rising memory chip prices and sustained global demand from AI data center...
Thursday 8 January 2026
TDK targets AI smartphones and foldables, plans to launch next-gen silicon anode battery
Japanese electronic components manufacturer TDK Electronics announced that it plans to update its industry-leading silicon anode battery technology later in 2026, coinciding with Apple...
Thursday 8 January 2026
Yageo subsidiary Pulse takes the lead in raising ferrite bead prices as silver price surges
Taiwan-based passive component giant Yageo continues to be affected by and respond to price hikes. Following Kemet's two price increases for tantalum capacitors within six months in...
Thursday 8 January 2026
Huawei's Ascend 950 tests South Korea's AI market
Huawei has signalled a renewed push into South Korea's AI infrastructure market, outlining plans to introduce its next-generation AI processor — widely expected to be the Ascend...
Thursday 8 January 2026
RISC-V's rise: A third CPU ecosystem in 5-10 years?
Bao Yungang, vice director of the Chinese Academy of Sciences' Institute of Computing Technology and chief scientist at the Beijing Open Source Chip Academy, predicts RISC-V will become...
Wednesday 7 January 2026
Marvell to acquire XConn to expand PCIe and CXL switching portfolio
Marvell Technology has agreed to acquire XConn Technologies to strengthen its position in PCIe, CXL, and UALink switching for AI data center infrastructure, as demand grows for scale-up...
Wednesday 7 January 2026
Apple reportedly locks in NAND through 2026 ahead of DRAM price spike
Apple has secured enough NAND flash memory to sustain production through the first quarter of 2026. But the iPhone maker is facing steep price increases for DRAM as artificial intelligence...
Wednesday 7 January 2026
Nvidia's Vera Rubin enters full production, igniting Micron's HBM4 capacity bet for 2026
When Nvidia CEO Jensen Huang confirmed at CES 2026 that its next-generation AI processor, Vera Rubin, had entered full production, the message to the memory industry was immediate...
Wednesday 7 January 2026
Zhen Ding Tech ramps 10 plants as 2026 capex tops US$1.6bn
Looking ahead to 2026, PCB industry leader Zhen Ding Tech. (ZDT) said demand remains solid across high-end applications such as AI servers, optical communications, and IC substrates,...