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    Commentary: Who will lead GaN market after TSMC's 2027 exit?
    2min ago
    Arm strengthens cloud ASIC ambitions with hire of former AWS executive and top engineers
    3min ago
    Tex Year Industries expands Vietnam plant to deepen Southeast Asia presence
    6min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Monday 21 April 2025
    Samsung makes headway in HBM4 chip yields, signaling a potential comeback in the high-end memory race

    As rivals race ahead in HBM3E, Samsung quietly builds momentum in next-gen HBM4 development, banking on its in-house chipmaking and packaging...

    Monday 21 April 2025
    Weekly news roundup: Huawei accelerates, Nvidia reels, and TSMC anchors next wave of US chip reshoring
    These are the most-read DIGITIMES Asia stories from the week of April 14 – April 20.
    Monday 21 April 2025
    Germany-Taiwan trade grows as German companies eye high-tech
    Taiwan and Germany recorded a 2% growth in bilateral trade in the first quarter of 2025, reaching US$5 billion despite mounting geopolitical tensions and concerns over US tariff policies,...
    Monday 21 April 2025
    Tariff fears cloud ASML's outlook as Intel, Samsung pull back
    Amid ongoing tariff disputes, the semiconductor industry is facing a severe test. In addition to the imminent semiconductor tariffs promised by US President Donald Trump, which remain...
    Monday 21 April 2025
    Can STMicro pivot? Legacy fab drag echoes Intel's struggle
    STMicroelectronics plans to cut 3,000 jobs by 2027, timing the announcement just ahead of its first-quarter 2025 earnings call on April 24. The preemptive move appears designed to...
    Saturday 19 April 2025
    Inside the tariff freeze: Bessent's quiet power play in the White House
    Is there a rift within Trump's camp over tariffs? Al Jazeera raised that very question as tensions flared between key figures in early April...
    Saturday 19 April 2025
    Huawei's AI ambitions face energy efficiency test

    Huawei's CloudMatrix 384 (CM384) is making waves as the most ambitious AI hardware rollout in China to date—a rack-scale system powered...

    Saturday 19 April 2025
    JEDEC rolls out HBM4 standard: 2TB/s memory poised to supercharge AI, HPC
    The global push to meet surging demand from AI, high-performance computing (HPC), and advanced data centers has reached a new milestone. JEDEC, the international semiconductor standards...
    Saturday 19 April 2025
    TSMC's trade war strategy: 3 bold moves to stay on top
    As Washington escalates tariff tensions, imposes new AI chip restrictions, and pressures chipmakers to invest in the US, TSMC finds itself navigating three major challenges that could...
    Friday 18 April 2025
    Micron challenges South Korean dominance in HBM market amid tariff protectionism
    Recently, reports from South Korea claim that Micron is set to become a rising star in the HBM market, following Samsung Electronics and SK Hynix. Although Donald Trump's current...
    Friday 18 April 2025
    Murata's global patent blitz targets Maxscend, threatens China's TF-SAW exports

    China's RF chip sector is facing a major disruption as Murata Manufacturing files five patent lawsuits against Maxscend Technologies...

    Friday 18 April 2025
    SK Hynix-Hanmi alliance fractures as Korean memory giant seeks new suppliers
    SK Hynix's eight-year partnership with Hanmi Semiconductor is showing signs of strain after the memory chipmaker began sourcing thermal compression bonding machines from rival Hanwha...
    Friday 18 April 2025
    Chips, China, and Congress: Nvidia and Jensen Huang's high-stakes diplomatic balancing act
    Nvidia CEO Jensen Huang returned to China this week in a markedly more high-profile visit than before. According to the Financial Times, he is expected to meet with DeepSeek founder...
    Friday 18 April 2025
    Yageo posts strong Q1 results, eyes growth in AI and EV sectors
    Taiwanese passive component manufacturer Yageo reported first-quarter operating results that exceeded market expectations, driven by a gradual normalization of inventory levels among...
    Friday 18 April 2025
    Hanmi hikes TCB equipment prices by nearly 30% for SK Hynix, ends free maintenance
    Hanmi Semiconductor has reportedly informed SK Hynix of a planned price increase for its thermal compression bonding (TCB) equipment, marking the first price hike since the South...
    110/295 pages
    Research Report Database
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 13 August 2025
    Advanced WLP and back-end solutions at SEMICON Taiwan 2025
    Wednesday 9 July 2025
    TRI unveils new multi-camera AOI, TR7500 SIII Ultra
    Wednesday 13 August 2025
    Alif Semiconductor vying for market dominance in battery-powered generative AI applications and Edge AI
    RESEARCH INSIGHTS
    Intel signals overhaul of IDM 2.0 and foundry strategy with Lip-Bu Tan's appointment, says DIGITIMES